Electronic component, circuit board arrangement, and method of manufacturing electronic component

A method of manufacturing an electronic component, the method comprising:

• forming an element body that includes a dielectric and an inner electrode;
• applying a mixed material, which is obtained by dispersing co-material particles in an electrode material containing a metal, to opposite side surfaces of the element body and peripheral surfaces of the element body adjacent to the side surfaces;
• sintering the mixed material to form base layers, in which the co-material particles are dispersed in the metal, on the opposite side surfaces and the peripheral surfaces of the element body;
• oxidizing the metal of the base layers to form an oxide film of the metal on exposed surfaces of the base layers;
• and
• blast polishing each of the exposed surfaces of the base layers from directions at oblique angles to the exposed surface of the base layers to remove the oxide film and to raise the metal over edges of the co-material particles that are at the exposed surface;
• and
• forming electrical conducting material layers on the base layers, respectively, in such a manner that each electrically-conducting material layer is in contact with the co-material particles and the metal raised over the edges of the co-material particles that were at the exposed surfaces of the corresponding base layer.