Method of manufacturing an electronic device and conductive paste for the same
AssigneeDuPont Polymers, Inc.
InventorsYUKA YOSHIIKE, YUMI MATSUURA
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Abstract
The invention relates to a method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer, wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent and 0.01 to 5 parts by weight of a dispersant and wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component.
Claims11
A method of manufacturing an electronic device comprising the steps of:
- preparing a substrate comprising an electrically conductive layer;
- applying a conductive paste on the electrically conductive layer, wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent and 0.01 to 5 parts by weight of a dispersant and wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof;
- mounting an electrical component on the applied conductive paste;
- and
- subsequent to the step of mounting the electrical component on the applied conductive paste, preheating the applied conductive paste at 80 to 180° C.;
- subsequent to the step of preheating the applied conductive paste, heating the conductive paste to bond the electrically conductive layer and the electrical component at 180 to 350° C.
Dependencies are inferred from the claim text.