Fingerprint sensor device and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
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Abstract
A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
Claims20
A method of manufacturing a fingerprint scanner, the method comprising:
- forming a first redistribution layer over a carrier substrate, the first redistribution layer comprising a series of conductive layers and a series of dielectric layers;
- attaching a sensor to an uppermost dielectric layer of the first redistribution layer, wherein the uppermost conductive layer of the first redistribution layer is laterally separated from the sensor;
- after attaching the sensor, attaching a sensor surface material to the sensor, wherein the sensor surface material has a first width that is less than a second width of the sensor;
- connecting a first contact pad of the sensor to the uppermost conductive layer of the first redistribution layer;
- and
- connecting a high voltage chip to the redistribution layer.
A method comprising:
- forming a first redistribution structure;
- forming through vias on the first redistribution structure, wherein the through vias are electrically connected to the first redistribution structure;
- attaching a fingerprint sensor device on the redistribution structure adjacent at least one through via, wherein the fingerprint sensor device comprises contact pads;
- encapsulating the fingerprint sensor device and the through vias with an encapsulant, wherein the encapsulant separates the through vias and the fingerprint sensor device;
- forming a second redistribution structure over the fingerprint sensor device and the through vias, wherein the second redistribution structure is electrically connected to the contact pads of the fingerprint sensor device and the through vias;
- forming a sensor surface material over the second redistribution structure;
- and
- attaching a high-voltage device to the first redistribution layer.
A method comprising:
- forming a through via in a first substrate;
- attaching the first substrate to a carrier substrate;
- attaching a fingerprint sensor device to the carrier substrate adjacent the first substrate;
- encapsulating the fingerprint sensor device and the first substrate with an encapsulant, wherein the encapsulant separates the fingerprint sensor device and the first substrate;
- forming a first redistribution structure over a first side of the fingerprint sensor device and the first substrate, wherein the first redistribution structure electrically connects the fingerprint sensor device and the through via of the first substrate;
- forming a second redistribution layer over a second side of the fingerprint sensor device and the first substrate wherein the second redistribution structure is electrically connected to the through via of the first substrate;
- and
- attaching a high voltage device to the second redistribution structure, wherein the high voltage device is electrically connected to the second redistribution structure.
Dependencies are inferred from the claim text.