Expelling air from a computer enclosure
AssigneeHewlett-Packard Development Company, L.P.
InventorsAndrew Wiltzius, Robert Crane, Heather Burnam Volesky, Julie Duke
Life of this patent
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Abstract
In an example implementation, a computer assembly includes a computer enclosure, a motherboard with an inset edge section that forms a motherboard air gap between the motherboard and a rear wall of the enclosure when the motherboard is installed in the enclosure, a vent opening formed in the enclosure below the motherboard, and an air mover to draw air from above the motherboard, through the air gap, and below the motherboard, and to expel the air drawn below the motherboard from the enclosure through the vent opening.
Claims15
A computer assembly comprising:
- a computer enclosure;
- a motherboard with an inset edge section that forms a motherboard air gap between the motherboard and a rear wall of the enclosure when the motherboard is installed in the enclosure;
- a vent opening formed in the enclosure below the motherboard;
- and,
- an air mover to draw air from above the motherboard, through the air gap, and below the motherboard, and to expel the air drawn below the motherboard from the enclosure through the vent opening.
A method of expelling air from a computer assembly comprising:
- providing a motherboard within a computer enclosure;
- providing an air gap between the motherboard and a rear wall of the computer enclosure;
- drawing air from a top side of the motherboard, through the air gap, to a bottom side of the motherboard;
- and,
- expelling the air drawn to the bottom side of the motherboard from the computer enclosure through an outlet vent formed in the computer enclosure below the motherboard.
A computer assembly comprising:
- a computer chassis to contain computer components including a motherboard;
- an air gap between the motherboard and a rear wall of the chassis fashioned by an inset section of the motherboard;
- an air mover located underneath the motherboard to draw air from above the motherboard, through the air gap, below the motherboard, and out of the chassis through a chassis outlet vent located below the motherboard.
Dependencies are inferred from the claim text.