Covers for electronic devices

An electronic device comprising:

• an electronic component;
• and
• a cover enclosing the electronic component, the cover comprising:
• an aluminum or aluminum alloy cover frame comprising an opening,
• a magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening,
• a protective coating over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel, and
• a chamfered edge including a chamfer at an edge of the aluminum or aluminum alloy cover frame, wherein the chamfer exposes the aluminum or aluminum alloy cover frame beneath the protective coating and wherein the chamfer does not expose the magnesium or magnesium alloy cover panel.

A method of making a cover for an electronic device comprising:

• forming an aluminum or aluminum alloy cover frame having an opening;
• casting a cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening from magnesium or a magnesium alloy;
• applying a protective coating over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel;
• and
• chamfering an edge of the aluminum or aluminum alloy cover frame, wherein the chamfering cuts through the protective coating to expose the aluminum or aluminum alloy cover frame and wherein the chamfering does not expose the magnesium or magnesium alloy cover panel.