Lithography system and method thereof

A method, comprising:

• transferring a wafer into a first chamber of a load lock, the first chamber being coupled to a gate valve assembly having a gate valve seal and a gate pressing against a protective film on a surface of the gate valve seal;
• moving the gate downwardly away from the protective film on the surface of the gate valve seal to reveal an opening of the gate valve seal;
• transferring the wafer from the first chamber, through the opening of the gate valve seal, to a second chamber;
• and
• performing a semiconductor process to the wafer in the second chamber.

A lithography system, comprising:

• a table body;
• a wafer stage moveably disposed over the table body;
• a first sliding member coupled to the wafer stage;
• a second sliding member coupled to an edge of the table body, the second sliding member being movable along a first direction, wherein the first sliding member is coupled to a track of the second sliding member, the first sliding member being movable along a second direction vertical to the first direction;
• a first cable coupled to the second sliding member and extending along the first direction;
• a first bracket fixing the first cable, the first bracket being coupled to a roller structure, wherein the roller structure comprises a body and a wheel coupled to the body;
• a rail guide confining a movement of the wheel of the roller structure;
• and
• a first protective film adhered to a surface of the rail guide, wherein the roller structure is moveable along the first protective film on the surface of the rail guide.