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US 2022/0066099 A1Published application
Structures and methods for high speed interconnection in photonic systems
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWeiwei SONG, Stefan RUSU, Mohammed Rabiul ISLAM
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Abstract
Structures and methods for high speed interconnection in photonic systems are described herein. In one embodiment, a photonic device is disclosed. The photonic device includes: a substrate; a plurality of metal layers on the substrate; a photonic material layer comprising graphene over the plurality of metal layers; and an optical routing layer comprising a waveguide on the photonic material layer.
Claims20
A photonic device, comprising:
- a substrate;
- a plurality of metal layers on the substrate;
- a photonic material layer comprising graphene over the plurality of metal layers;
- and
- an optical routing layer comprising a waveguide on the photonic material layer.
2 more elements
An optical communication system, comprising:
- an electrical to optical convertor, and
- an optical to electrical convertor, wherein each of the electrical to optical convertor and the optical to electrical convertor comprises:
- a bulk silicon substrate,
- a plurality of metal layers on the bulk silicon substrate,
- a plurality of waveguides over the plurality of metal layers, and
- a photonic material layer comprising graphene located below a top surface of each of the plurality of waveguides.
3 more elements
A method for forming a photonic device, comprising:
- forming a plurality of metal layers on a bulk silicon substrate;
- depositing a contact layer comprising a plurality of metal contacts over the plurality of metal layers;
- forming a photonic material layer comprising at least one two-dimensional material on the contact layer, and
- depositing, according to a structure pattern, an optical routing material onto the photonic material layer to form an optical routing layer comprising a plurality of waveguides.
1 more element
Dependencies are inferred from the claim text.