Image acquiring method, image acquiring apparatus and wafer inspection apparatus
AssigneeSemes Co., Ltd.
InventorMyoung Hoon WOO
Life of this patent
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Abstract
An image acquiring method, an image acquiring apparatus and a wafer inspection apparatus are disclosed. A line scan camera is disposed above a transfer path of a wafer to continuously acquire partial images having a predetermined size by imaging a scan area including a portion of the transfer path, and the partial images are stored in an image storage unit. A partial image including a predetermined feature point among the partial images is detected by an image analysis unit, and an image merging unit merges a predetermined number of partial images including the detected partial image to acquire an entire image of the wafer. An image inspection unit analyzes the entire image of the wafer to detect defects in the wafer.
Claims20
An image acquiring method comprising:
- continuously acquiring partial images having a predetermined size by imaging a scan area perpendicular to a transfer path of a wafer using a line scan camera disposed above the transfer path of the wafer;
- detecting a partial image including a predetermined feature point from among the partial images;
- and
- merging a predetermined number of partial images including the detected partial image to acquire an entire image of the wafer.
An image acquiring apparatus comprising:
- a line scan camera disposed above a transfer path of a wafer and for continuously acquiring partial images having a predetermined size by imaging a scan area perpendicular to the transfer path of the wafer;
- an image storage unit for storing the partial images;
- an image analysis unit for detecting a partial image including a predetermined feature point from among the partial images;
- and
- an image merging unit merging a predetermined number of partial images including the detected partial image to acquire an entire image of the wafer.
A wafer inspection apparatus comprising:
- a line scan camera disposed above a transfer path of a wafer and for continuously acquiring partial images having a predetermined size by imaging a scan area perpendicular to the transfer path of the wafer;
- an image storage unit for storing the partial images;
- an image analysis unit for detecting a partial image including a predetermined feature point from among the partial images;
- an image merging unit merging a predetermined number of partial images including the detected partial image to acquire an entire image of the wafer;
- and
- an image inspection unit for detecting defects of the wafer from the entire image of the wafer.
Dependencies are inferred from the claim text.