Liquid leak sensor and method of fabricating the same
OwnerBeak Myeong SEONGinventor
Life of this patent
Estimating the term…
Loading patent…
OwnerBeak Myeong SEONGinventor
Estimating the term…
The present disclosure relates to a method of fabricating a liquid leak sensor and, more particularly, to a method of fabricating a liquid leak sensor, which is cheap and can be easily fabricated by consecutively disposing a nonconductive layer and a conductive layer and compressing the layers. The method may include shaping a nonconductive mold article having a flat top surface and bottom surface using nonconductive powder, shaping a conductive mold article having a flat top surface and bottom surface using a conductive raw material, alternately stacking the nonconductive mold article and the conductive mold article on a die up and down, shaping a single compressed article by applying pressure to the stacked nonconductive mold article and conductive mold article up and down using presses, sintering the molded compressed article, and performing skiving processing on a side of the sintered compressed article to a given thickness.
A liquid leak sensor wherein a conductive layer is sintered and located on a side of a nonconductive layer made of a nonconductive material and the nonconductive layer and the conductive layer are alternately sintered and located at least once.
A method of fabricating a leak liquid leak sensor, comprising:
A method of fabricating a leak liquid leak sensor, comprising:
Dependencies are inferred from the claim text.