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US 2022/0065730 A1Published application
Wafer processing apparatus and control method thereof
AssigneeZeus Co., Ltd.
InventorsWoon KONG, Ji Hoon SONG, Ji Ho PARK
Life of this patent
Estimating the term…
Abstract
A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover installed on a circumferential portion of the vacuum chuck, a medium supply part connected to the vacuum chuck to supply an inspection medium to the vacuum chuck, and a sealing ring which is installed in the vacuum chuck to support the wafer and into which the inspection medium supplied to the vacuum chuck is introduced.
Claims20
A wafer processing apparatus comprising:
- a vacuum chuck on which a wafer is seated;
- a ring cover installed on a circumferential portion of the vacuum chuck;
- a medium supply part connected to the vacuum chuck to supply an inspection medium to the vacuum chuck;
- and
- a sealing ring which is installed in the vacuum chuck to support the wafer and into which the inspection medium supplied to the vacuum chuck is introduced.
2 more elements
A control method of a wafer processing apparatus, comprising:
- supplying an inspection medium to a sealing ring as a medium supply part is driven;
- detecting whether the inspection medium leaks from the sealing ring;
- and
- determining whether the sealing ring is damaged by whether the inspection medium leaks.
1 more element
Dependencies are inferred from the claim text.