Proximity sensor device and system

A proximity sensor device, comprising a single monolithic integrated semiconductor substrate comprising:

• an active surface, the active surface comprising at least one component selected from the group consisting of:
• an active component, a passive component, and a bond pad;
• an interconnection stack on top of the active surface, the interconnection stack comprising a plurality of at least two metal layers separated by isolation layers;
• at least a first transmitter coil and a first receiver coil electrically insulated from one another,
• the first transmitter coil having a first spiral course with at least three turns formed in a first subset of at least one metal layer selected from said plurality of metal layers, and
• wherein an orthogonal projection of the first spiral course on the active substrate has a first inner periphery and a first outer periphery;
• the first receiver coil having a second spiral course with at least three turns formed in a second subset of at least one metal layer selected from said plurality of metal layers, and
• wherein an orthogonal projection of the second spiral course on the active substrate has a second inner periphery and a second outer periphery;
• wherein said at least one component or bond pad is located inside the first inner periphery and inside the second inner periphery, or is located inside the first inner periphery but outside of the second outer periphery.