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US 2022/0065608 A1Published application
Apparatus and method for deformation measurement
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHsuan-Yu CHEN, Ming-Han WANG
Life of this patent
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Abstract
An apparatus for deformation measurement and a method for deformation measurement are provided. The apparatus includes a housing, a sample holder, a moving mechanism, a first heating device and a second heating device. The sample holder is in the housing. The moving mechanism is over the sample holder. The first heating device is on the moving mechanism. The second heating device is below the sample holder.
Claims20
An apparatus for deformation measurement, comprising:
- a housing;
- a sample holder in the housing;
- a moving mechanism over the sample holder;
- a first heating device on the moving mechanism;
- and
- a second heating device below the sample holder.
3 more elements
An apparatus for deformation measurement, comprising:
- a housing;
- a sample holder in the housing;
- a first heating device over the sample holder;
- a cooling device over the sample holder, the cooling device including:
- an outlet configured to provide liquid nitrogen into the housing;
- and
- a collecting mechanism directly below the outlet, configured to collect the liquid nitrogen from the outlet and allow nitrogen vapor filling the housing;
- and
- a moving mechanism coupled to the cooling device and the first heating device.
6 more elements
A method for deformation measurement, comprising:
- placing a sample on a sample holder in a housing;
- heating the sample with a first heating device over the sample holder and a second heating device below the sample holder until a temperature of the sample reaches a predetermined value;
- temporarily removing the first heating device from projecting over the sample;
- and
- performing a first measurement to a deformation of the sample by an image sensor outside the housing, wherein the temperature of the sample is maintained substantially equal to the predetermined value by the second heating device during the first measurement.
2 more elements
Dependencies are inferred from the claim text.