Heat transferring device and method for making thereof
AssigneeCity University of Hong Kong
InventorsZuankai WANG, Mengnan JIANG, Yang WANG
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Abstract
The present invention provides a heat transferring device and a method for making thereof. The heat transferring device has a thermal conducting substrate and a porous layer. The thermal conducting substrate has a plurality of protrusions and concave bottom surfaces. The concave bottom surfaces are located between the protrusions. The porous layer is embedded between the protrusions. The present invention also provides a high temperature material transferring system comprising a cylindrical container and the heat transferring device disposed on the surface of the cylindrical container.
Claims19
A heat transferring device, including:
- a thermal conducting substrate having a plurality of protrusions and concave bottom surfaces, wherein the concave bottom surfaces are located between the protrusions;
- and
- a porous layer embedded between the protrusions.
A method of forming a heat transferring device, comprising:
- providing a thermal conducting substrate;
- forming a plurality of protrusions and concave bottom surfaces, wherein the concave bottom surfaces are located between the protrusions;
- and
- embedding a porous layer between the protrusions.
Dependencies are inferred from the claim text.