Heat conduction member
AssigneesNidec Chaun-Choung Technology Corporation, Nidec Corporation
InventorsMasaaki HANANO, Junichi ISHIDA, Toshihiko KOSEKI
Life of this patent
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Abstract
A heat conductor includes a housing including a space therein and a working medium in the space. The housing includes an upper plate on an upper side of the housing in a thickness direction and covering an upper side of the space, a lower plate on a lower side of the space and opposing the upper plate in the thickness direction, and pillars located between the upper plate and the lower plate. The housing further includes bent portions in which both the upper plate and the lower plate are bent in a same direction in the thickness direction. The pillars are located only outside at least one section between two of the bent portions.
Claims6
A heat conductor, comprising:
- a housing including a space therein;
- and
- a working medium in the space;
- wherein
- the housing includes:
- an upper plate located on an upper side of the housing in a thickness direction and covering an upper side of the space;
- a lower plate located on a lower side of the space and opposing the upper plate in the thickness direction;
- and
- pillars located between the upper plate and the lower plate;
- the housing further includes bent portions in which both the upper plate and the lower plate are bent in a same direction in the thickness direction;
- and
- the pillars are located only outside at least one section between two of the bent portions.
Dependencies are inferred from the claim text.