Heat conduction member
AssigneesNidec Chaun-Choung Technology Corporation, Nidec Corporation
InventorsMasaaki HANANO, Junichi ISHIDA, Toshihiko KOSEKI
Life of this patent
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Abstract
A heat conductor includes a housing including a space therein and a working medium in the space. The housing includes an upper plate on an upper side of the housing in a thickness direction and covering an upper side of the space, a lower plate on a lower side of the space and opposing the upper plate in the thickness direction, and pillars located between the upper plate and the lower plate. The housing further includes a bent portion in which both the upper plate and the lower plate are bent in a same direction in the thickness direction. The bent portion is located between some of the pillars.
Claims7
A heat conductor, comprising:
- a housing including a space therein;
- and
- a working medium in the space, wherein:
- the housing includes:
- an upper plate located on an upper side of the housing in a thickness direction and covering an upper side of the space;
- a lower plate located on a lower side of the space and opposing the upper plate in the thickness direction;
- and
- pillars located between the upper plate and the lower plate;
- the housing further includes a bent portion in which both the upper plate and the lower plate are bent in the same direction in the thickness direction;
- and
- the bent portion is located between some of the pillars.
Dependencies are inferred from the claim text.