Vapor deposition device

A vapor deposition device which is provided with a ring-shaped carrier that supports an outer edge of a wafer, and which uses a plurality of the carriers to:

• transport a plurality of before-treatment wafers from a wafer storage container, through a factory interface, load-lock chamber, and wafer transfer chamber, to a reaction chamber in that order, and
• transport a plurality of after-treatment wafers from the reaction chamber, through the wafer transfer chamber, load-lock chamber, and factory interface, to the wafer storage container in that order,
• and in which the load-lock chamber communicates with the factory interface via a first door and also communicates with the wafer transfer chamber via a second door,
• the wafer transfer chamber communicates, via a gate valve, with the reaction chamber in which a CVD film is formed on the wafer,
• the wafer transfer chamber is provided with a first robot that deposits a before-treatment wafer transported into the load-lock chamber into the reaction chamber in a state where the before-treatment wafer is mounted on a carrier and also withdraws an after-treatment wafer for which treatment in the reaction chamber has ended from the reaction chamber in a state where the after-treatment wafer is mounted on a carrier and transports the wafer to the load-lock chamber, and
• the factory interface is provided with a second robot that extracts a before-treatment wafer from the wafer storage container and mounts the wafer on a carrier standing by in the load-lock chamber, and also stores in the wafer storage container an after-treatment wafer mounted on the carrier that has been transported to the load-lock chamber,
• wherein the load-lock chamber is provided with a holder which can support the carrier and the wafer.

A vapor deposition device which is provided with a ring-shaped carrier that supports an outer edge of a wafer, and which uses a plurality of the carriers to:

• transport a plurality of before-treatment wafers from a wafer storage container, through a factory interface, load-lock chamber, and wafer transfer chamber, to a reaction chamber in that order, and
• transport a plurality of after-treatment wafers from the reaction chamber, through the wafer transfer chamber, load-lock chamber, and factory interface, to the wafer storage container in that order,
• and in which the load-lock chamber communicates with the factory interface via a first door and also communicates with the wafer transfer chamber via a second door,
• the wafer transfer chamber communicates, via a gate valve, with the reaction chamber in which a CVD film is formed on the wafer,
• the wafer transfer chamber is provided with a first robot that deposits a before-treatment wafer transported into the load-lock chamber into the reaction chamber in a state where the before-treatment wafer is mounted on a carrier and also withdraws an after-treatment wafer for which treatment in the reaction chamber has ended from the reaction chamber in a state where the after-treatment wafer is mounted on a carrier and transports the wafer to the load-lock chamber,
• the factory interface is provided with a second robot that extracts a before-treatment wafer from the wafer storage container and mounts the wafer on a carrier standing by in the load-lock chamber, and also stores in the wafer storage container an after-treatment wafer mounted on the carrier that has been transported to the load-lock chamber, and
• the load-lock chamber is provided with a holder that supports the carrier,
• wherein the reaction chamber is provided with a support shaft which supports a susceptor and rotates by a rotation drive unit and a lift shaft which moves up and down with respect to the support shaft by a lifting drive unit,
• the lift shaft is provided with a first mounting portion on which a carrier lifting pin can be mounted and a second mounting portion on which a wafer lifting pin can be mounted,
• the support shaft is provided with a first through hole through which the carrier lifting pin mounted on the first mounting portion can penetrate and a second through hole through which the wafer lifting pin mounted on the second mounting portion can penetrate.