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US 2022/0064577 A1Published application
Cleaning compositions and methods of use thereof
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsZachary L. Schaefer, Eric Turner, Carl Ballesteros
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Abstract
The present disclosure relates to cleaning compositions that are used to clean semiconductor substrates. These cleaning compositions can remove the defects/contaminants arising from previous processing on the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one pH adjusting agent and at least one biosurfactant.
Claims19
A cleaning composition, comprising:
- at least one pH adjusting agent;
- and
- at least one biosurfactant selected from the group consisting of glycolipids, lipopeptides, and mixtures thereof:
- wherein the composition has a pH of from about 1 to about 14.
1 more element
Dependencies are inferred from the claim text.