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US 2022/0064488 A1Published application
Polishing slurry composition
AssigneeKctech Co., Ltd.
InventorsNak Hyun CHOI, Jung Yoon KIM, Hae Won YANG, Soo Wan CHOI
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Abstract
The present invention relates to a polishing slurry composition. A polishing slurry composition according to an embodiment of the present disclosure comprises: a nonionic polymer having at least one amide bond; a selectivity control agent; and abrasive particles.
Claims20
A polishing slurry composition comprising:
- a non-ionic (macromolecule) polymer having at least one amide bond;
- a selectivity control agent;
- and
- abrasive particles.
1 more element
Dependencies are inferred from the claim text.