Radiation Curable Composition with Improved Mechanical Properties

A curable composition, comprising

• a) at least one first polymer A comprising at least one terminal group of the general formula (I)
• -A1-C(═O)—CR1═CH2 (I),
• wherein
• A1 is a divalent bonding group containing at least one heteroatom;
• and
• R1 is selected from hydrogen and C1 to C4 alkyl;
• and,
• optionally, at least one terminal group of the general formula (II)
• -A2-SiXYZ (II),
• wherein
• A2 is a divalent bonding group containing at least one heteroatom;
• and
• X, Y, Z are each, independently of one another, selected from the group consisting of a hydroxyl group, C1 to C8 alkyl group, C1 to C8 alkoxy group, and C1 to C8 acyloxy group, wherein X, Y, Z are substituents directly bound with the Si atom or the two of the substituents X, Y, Z form a ring together with the Si atom to which they are bound, and at least one of the substituents X, Y, Z is selected from the group consisting of a hydroxyl group, C1 to C8 alkoxy group and C1 to C8 acyloxy group,
• b) optionally, at least one second polymer B comprising at least one terminal group of the general formula (II)
• -A2-SiXYZ (II),
• wherein
• A2 is a divalent bonding group containing at least one heteroatom;
• and
• X, Y, Z are each, independently of one another, selected from the group consisting of a hydroxyl group, C1 to C8 alkyl group, C1 to C8 alkoxy group, and C1 to C8 acyloxy group, wherein X, Y, Z are substituents directly bound with the Si atom or the two of the substituents X, Y, Z form a ring together with the Si atom to which they are bound, and at least one of the substituents X, Y, Z is selected from the group consisting of a hydroxyl group, C1 to C8 alkoxy and C1 to C8 acyloxy group,
• c) at least one reactive diluent,
• d) at least one photoinitiator,
• e) at least one filler,
• f) optionally, at least one adhesion promoter, and
• g) optionally, at least one curing catalyst.