Thermosetting resin composition for lds and method for manufacturing semiconductor device

A thermosetting resin composition for laser direct structuring (LDS) which is used for LDS, the thermosetting resin composition for LDS comprising the following components:

• (A) a thermosetting resin;
• (B) an inorganic filler;
• (C) a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays;
• and
• (D) a coupling agent,
• wherein the component (A) contains one or more selected from the group consisting of an epoxy resin and a bismaleimide resin, and
• at least one of the following condition 1 or condition 2 is satisfied:
• (condition 1) a ratio of particles having a particle size equal to or more than 1 μm and equal to or less than 20 μm in the component (B) is equal to or more than 40% by volume and equal to or less than 95% by volume with respect to a total volume of the component (B), and
• (condition 2) the thermosetting resin composition for LDS is granular, and an angle of fall of the thermosetting resin composition for LDS is equal to or less than 35°.