Inorganic powder for heat-dissipating resin composition, heat-dissipating resin composition using same, and methods for producing same

Abstract

Provided are an inorganic powder suitable for the production of a thick heat-dissipating resin composition and a heat-dissipating resin composition using the inorganic powder. An inorganic powder 10 for use in a heat-dissipating resin composition 20, comprises: first inorganic particles 11 having a particle diameter of less than 53 μm; and second inorganic particles 12 having a particle diameter of 100 μm or more and a BET specific surface area of 2 m2/g or less, a content of the second inorganic particles 12 being 30 to 95% by mass. The heat-dissipating resin composition 20 comprises: a resin 30; and an inorganic powder 10, wherein the heat-dissipating resin composition 20 contains the second inorganic particles 12 in an amount of 100 parts by weight per 100 parts by weight of the resin.

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