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US 2022/0064352 A1Published application
High temperature, conductive thermosetting resin compositions
AssigneeTclad Inc.
InventorStanley Shengqian KONG
Life of this patent
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Abstract
The present invention provides high temperature performing, conductive thermosetting resin compositions.
Claims33
A composition comprising:
- (a) A resin comprising:
- (i) a first compound having one or more functional groups selected from maleimides, nadimides or itaconimides;
- (ii) a second compound having one or more functional groups selected from maleimides, nadimides or itaconimides, said second compound being different from the first compound;
- and
- (iii) an allyl-functionalized phenolic compound;
- (b) A thermally conductive filler in an amount of about 0.01 to about 20 weight equivalents of the total resin;
- and
- (c) A solvent selected from cycloalkanones, dialkyl formamides, dialkyl acetamides, and combinations thereof.
5 more elements
A composition comprising:
- (a) A resin comprising:
- (i) a first compound having one or more functional groups selected from maleimides, nadimides or itaconimides;
- and
- (ii) an aromatic compound functionalized with one or more ether group(s) and one or more allyl group(s);
- (b) A thermally conductive filler in an amount of about 0.01 to about 20 weight equivalents of the total resin;
- and
- (c) A solvent selected from cycloalkanones, dialkyl formamides, dialkyl acetamides, and combinations thereof.
4 more elements
A composition of matter comprising:
- (a) a first compound having two functional groups selected from maleimides, nadimides or itaconimides;
- and
- (b) an ether- and allyl-functionalized aromatic compound wherein said aromatic compound has two ether functional groups and two allyl groups.
Dependencies are inferred from the claim text.