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AssigneeMitsubishi Materials Corporation
InventorsShuji Nishimoto, Satoshi Takakuwa
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A method of producing a copper/ceramic bonded body, the copper member having a composition having a Cu purity of 99.96 mass % or more, a balance of inevitable impurities, a P content of 2 mass ppm or less, and a total content of Pb, Se and Te of 10 mass ppm or less, the method includes bonding the laminated copper member and the ceramic member by pressing and heating, wherein an average crystal grain size of the copper member before bonding is 10 μm or more, an aspect ratio is 2 or less, and a pressing load is 0.05 MPa or more and 1.5 MPa or less, a heating temperature is 800° C. or higher and 850° C. or lower, and a holding time at the heating temperature is 10 minutes or longer and 90 minutes or shorter.
A method of producing a copper/ceramic bonded body with a copper member and a ceramic member bonded each other, the copper member having a composition having a Cu purity of 99.96 mass % or more, a balance of inevitable impurities, a P content of 2 mass ppm or less, and a total content of Pb, Se and Te of 10 mass ppm or less, the method comprises:
A copper/ceramic bonded body comprising a copper member and a ceramic member bonded to each other, wherein
An insulating circuit board comprising a ceramic substrate and a copper plate bonded to a surface of the ceramic substrate, wherein
Dependencies are inferred from the claim text.