US 2022/0063988 A1 · MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

Abstract

A micro-electro-mechanical system (MEMS) package structure and a method of fabricating the MEMS package structure. The MEMS package structure includes a MEMS die (210,220) and a device wafer (100). A control unit and an interconnection structure (300) are formed in the device wafer (100), and a first contact pad (410) is formed on a first surface (100a) of the device wafer. The MEMS die (210,220) includes a micro-cavity (221), a second contact pad (201) configured to be coupled to an external electrical signal, and a bonding surface (200a,220a). The micro-cavity (221) of the MEMS die (210,220) is provided with a through hole (221a) in communication with the exterior of the die. The MEMS die (210,220) is bonded to the first surface (100a) by a bonding layer (500), in which an opening (510) is formed. The first contact pad (410) is electrically connected to the second contact pad (201), and a rewiring layer (700) is arranged on a second surface (100b) opposing the first surface (100a). The MEMS package structure allows electrical interconnection between the MEMS die and the device wafer with a reduced package size, compared to those produced by existing integration techniques. In addition, a plurality of MEMS dies of the same or different structures and functions are allowed to be integrated on the same device wafer.

Claims19

Dependent claims

A micro-electro-mechanical system (MEMS) package structure, comprising:

a device wafer having a first surface and a second surface opposite to the first surface, wherein the device wafer has a control unit, a first interconnection structure and a second interconnection structure arranged therein, the first and second interconnection structures electrically connected to the control unit;
a first contact pad arranged on the first surface, wherein the first contact pad is electrically connected to the first interconnection structure;
a MEMS die bonded to the first surface, wherein the MEMS die comprises a micro-cavity, a second contact pad configured to be coupled to an external electrical signal and a bonding surface in opposition to the first surface, the micro-cavity of the MEMS die having a through hole in communication with an exterior of the die, the first contact pad electrically connected to a corresponding second contact pad;
a bonding layer positioned between the first surface and the bonding surface so as to bond the MEMS die to the device wafer, wherein an opening is formed in the bonding layer;
and
a rewiring layer arranged on the second surface, wherein the rewiring layer is electrically connected to the second interconnection structure.

3 more elements

A method for fabricating a micro-electro-mechanical system (MEMS) package structure, comprising:

providing a MEMS die and a device wafer for control of the MEMS die, wherein the device wafer has a first surface configured to bond the MEMS die, and wherein the device wafer has a control unit and a first interconnection structure electrically connected to the control unit formed therein;
forming a first contact pad on the first surface, wherein the first contact pad is electrically connected to the first interconnection structure, wherein the MEMS die comprises a micro-cavity, a second contact pad configured to be coupled to an external electrical signal and a bonding surface, and wherein the micro-cavity of the MEMS die has a through hole in communication with an exterior of the die;
bonding the MEMS die to the device wafer through a bonding layer positioned between the first surface and the bonding surface, wherein the bonding layer has an opening formed therein, wherein the first contact pad and a corresponding second contact pad are exposed in the opening;
establishing an electrical connection between the first contact pad and the corresponding second contact pad;
forming a second interconnection structure in the device wafer, wherein the second interconnection structure is electrically connected to the control unit;
and
forming a rewiring layer on a surface of the device wafer in opposition to the first surface, wherein the rewiring layer is electrically connected to the second interconnection structure.

4 more elements

Dependencies are inferred from the claim text.

Mems package structure and manufacturing method therefor

Life of this patent

Mems package structure and manufacturing method therefor

Life of this patent

Abstract

Claims19