US 2022/0063987 A1 · MEMS PACKAGING STRUCTURE AND FABRICATION METHOD THEREFOR

Abstract

A micro-electro-mechanical system (MEMS) package structure and a method for fabricating the MEMS package structure. The MEMS package structure includes a MEMS die (210,220) and a device wafer (100). The MEMS die (210,220) is arranged on a first surface (100a) of the device wafer and includes a closed micro-cavity (211,221) and a contact pad (212,222) configured to be coupled to an external electrical signal. In the device wafer (100), there are arranged a control unit and an interconnection structure (300) electrically connected to each of the contact pad (212,222) and the control unit. On a second surface (100b) of the device wafer, there is arranged a rewiring layer (400) electrically connected to the interconnection structure (300). According to the MEMS package structure fabrication method, arranging the MEMS die (210,220) and the rewiring layer (400) on opposing sides of the device wafer (100) is conducive to shrinkage of the MEMS package structure. In addition, the MEMS package structure allows the integration of a plurality of MEMS dies of the same or different structures and functions on the same device wafer.

Claims16

Dependent claims

A micro-electro-mechanical system (MEMS) package structure, comprising:

a MEMS die comprising a closed micro-cavity and a contact pad configured to be coupled to an external electrical signal;
a device wafer having a first surface and a second surface opposite to the first surface, wherein the MEMS die is bonded to the first surface, and wherein a control unit associated with the MEMS die is arranged in the device wafer;
an interconnection structure arranged in the device wafer, wherein the interconnection structure is electrically connected to each of the contact pad and the control unit;
and
a rewiring layer arranged on the second surface, wherein the rewiring layer is electrically connected to the interconnection structure.

2 more elements

A method for fabricating a micro-electro-mechanical system (MEMS) package structure, comprising:

providing a MEMS die and a device wafer for control of the MEMS die, wherein:
the MEMS die comprises a closed micro-cavity and a contact pad configured to be coupled to an external electrical signal;
the device wafer has a first surface;
and a control unit is formed in the device wafer;
bonding the MEMS die to the first surface;
forming an interconnection structure in the device wafer, wherein the interconnection structure is electrically connected to each of the contact pad and the control unit;
and
forming a rewiring layer on a surface of the device wafer opposing the first surface, wherein the rewiring layer is electrically connected to the interconnection structure.

5 more elements

Dependencies are inferred from the claim text.

Mems packaging structure and fabrication method therefor

Life of this patent

Mems packaging structure and fabrication method therefor

Life of this patent

Abstract

Claims16