Film forming apparatus and method for manufacturing part having film containing silicon
AssigneeTokyo Electron Limited
InventorsTakayuki ISHII, Kazuya NAGASEKI, Michishige SAITO
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Abstract
A film forming apparatus is disclosed. The apparatus comprises a chamber; an exhaust unit configured to reduce the pressure in the chamber to a predetermined vacuum level; a holder disposed in the chamber and configured to hold a film forming target member on which a film is to be formed; a supply unit configured to supply a film forming material containing silicon to a surface of the film forming target member; and a heat source configured to perform heating at the predetermined vacuum level to melt the supplied film forming material.
Claims20
A film forming apparatus comprising:
- a chamber;
- an exhaust unit configured to reduce the pressure in the chamber to a predetermined vacuum level;
- a holder disposed in the chamber and configured to hold a film forming target member on which a film is to be formed;
- a supply unit configured to supply a film forming material containing silicon to a surface of the film forming target member;
- and
- a heat source configured to perform heating at the predetermined vacuum level to melt the supplied film forming material.
A method for manufacturing a part having a film containing silicon comprising:
- holding a film forming target member on which a film is to be formed using a holder disposed in a chamber;
- reducing the pressure in the chamber to a predetermined vacuum level;
- supplying a film forming material containing silicon from a supply unit to a surface of the film forming target member;
- and
- melting the supplied film forming material using a heat source configured to perform heating at the predetermined vacuum level.
Dependencies are inferred from the claim text.