Die Bonding Apparatus, Cleaning Head and Manufacturing Method for Semiconductor Device

A cleaning head comprising:

• a body section;
• and
• a first nozzle and a second nozzle that blow out air to a work and a suction aperture that sucks air from a side of the work,
• wherein a bottom surface of the body section is rectangular in a planar view,
• the suction aperture is rectangular in a planar view, long sides of the suction aperture extend along long sides of the bottom surface, and the suction aperture is disposed between a blowout opening of the first nozzle and a blowout opening of the second nozzle while being located near to the both blowout openings,
• the blowout opening of the first nozzle is configured to extend along one of the long sides of the suction aperture in a planar view, and is also configured to extend perpendicularly to a surface of the work, and
• the blowout opening of the second nozzle is configured to extend along another of the long sides of the suction aperture in a planar view, and is also configured to extend aslant toward the suction aperture rather than perpendicularly to the surface of the work.

A manufacturing method for semiconductor device comprising the steps of:

• (a) transferring a substrate to a die bonding apparatus that includes:
• a transfer section for transferring a substrate on which a die is to be mounted in a first direction;
• a cleaning head including a first nozzle and a second nozzle that blow out air to the substrate and a suction aperture that sucks in air from the substrate side;
• and a drive section that moves the cleaning head in a second direction that is different from the first direction, wherein the suction aperture is rectangular in a planar view, long sides of the suction aperture extend in the first direction, and the suction aperture is disposed between a blowout opening of the first nozzle and a blowout opening of the second nozzle while being located near to the both blowout openings, the blowout opening of the first nozzle is configured to extend along one of the long sides of the suction aperture in a planar view, and is also configured to extend perpendicularly to a surface of the substrate, and the blowout opening of the second nozzle is configured to extend along another of the long sides of the suction aperture in a planar view, and is also configured to extend to extend aslant toward the suction aperture rather than perpendicularly to the surface of the substrate,
• (b) transferring a wafer ring holding a dicing tape to which a die is attached,
• (c) cleaning the substrate,
• (d) picking up the die, and
• (e) bonding the picked-up die to the substrate or a die that has already been bonded.