Method for manufacturing an opto-electronic component substrate and associated devices

Abstract

The invention relates to a method for manufacturing an optoelectronic component substrate (12) comprising a stack of layers, the method comprising a step of: preforming a substrate (12) comprising a face which has a pattern with at least one zone made of a first material and one zone made of a second material, the two materials being thermosetting or thermoplastic materials, the first material being an electrically conductive material and the second material being an electrically insulating material, and molding by compression the face of the substrate (12) with a face of a reference element (22) having a surface roughness less than or equal to 50 nanometers.

Dependencies are inferred from the claim text.