Pressure control system for liquid-cooled electronic component cooling device

A pressure control system for a liquid-cooled electronic component cooling device, the pressure control system comprising:

• a cooling device configured to cool an electronic component through a refrigerant moving along a pipe;
• a radiator mounted on one side of the cooling device to exchange heat with the refrigerant, and configured to include a vent hole extending outwardly from one side inside the radiator and on an inner circumferential surface on which threads are formed;
• a head having discharge holes communicating with a plurality of first hollows formed therein along a circumference of an outer circumferential surface thereof with a driver hole provided in an upper surface thereof;
• a body coupled to a bottom side of the head and having a second hollow communicating with the first hollows in a lengthwise direction;
• and
• a pressure controller configured to extend outward from a bottom of the body with an inner portion thereof communicating with the second hollow, and comprising a coupler having threads on one side of an outer circumferential surface thereof so as to be screwed into the vent hole.