Printing patterns via die cutting
Assignee3M Innovative Properties Company
InventorsThomas J. Metzler, Kara A. Meyers, Saagar A. Shah, Mikhail L. Pekurovsky, Matthew S. Stay, Shawn C. Dodds, Kevin T. Reddy, John T. Strand, Daniel J. Theis, Jeremy O. Swanson, Daniel M. Lentz
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Abstract
Methods, apparatuses and systems for printing an ink pattern on a moving web via die cutting are provided. A die roll including an inked pattern of die blades contacts a substrate to cut or cleave the substrate surface. While the die blades withdraw from the substrate, at least some of the ink transfers from the die blades to the cut substrate to form an ink pattern.
Claims20
A method of printing, comprising:
- inking one or more die blades on a surface of a die roll by providing an ink material to the die blades;
- contacting the die blades to a substrate to cleave a surface of the substrate and make one or more notches thereon;
- and
- while detaching the die blades from the substrate, transferring at least some of the ink material from the die blades of the die roll to the respective notches on the substrate to form an ink pattern thereon.
A printing system comprising:
- a die roll having a pattern of die blades on a surface thereof configured to receive an ink material;
- an impression roll positioned adjacent to the die roll to form a nip;
- and
- a substrate provided into the nip,
- wherein the die blades cleave a surface of the substrate to make one or more notches thereon, and at least some of the ink material is transferred from the die blades to the respective notches on the substrate to form an ink pattern thereon while the substrate exits the nip, the ink pattern corresponding to the pattern of die blades.
The method according to embodiment 19, wherein the new surfaces have a higher surface energy than that of the surface of the substrate.
Dependencies are inferred from the claim text.