# US 2022/0046818 A1 · Memory devices, carriers for same, and related computing systems and methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2022/0046818 A1 - Document ID: US20220046818A1 - Status: Published application - Kind: A1 - Application number: 17/393,572 - Filed: 2021-08-04 - Published: 2022-02-10 - Earliest claimed: 2020-08-05 - Assignees: Micron Technology, Inc. - Applicants: Micron Technology, Inc. - Inventors: Michael G. Placke - Web page: https://patentgrep.com/patent/US20220046818A1 ## CPC - H05K 7/1492: {having electrical distribution arrangements, e.g. power supply or data communications} - G06F 3/0688: {Non-volatile semiconductor memory arrays} - H05K 1/181: associated with surface mounted components - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections - H05K 2201/09172: Notches between edge pads - H05K 2201/10159: Memory - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract Memory devices may include a substrate supporting at least one semiconductor device thereon. The substrate may include an interface sized, shaped, and configured to provide electrical connection to the at least one semiconductor device, the interface located proximate to an end of the substrate. Engagement structures may be located proximate to, and laterally outward from, the interface. The engagement structures may extend laterally beyond a remainder of a lateral periphery of the substrate, each engagement structure comprising a first depth at a first portion of the engagement structure and a second, smaller depth at a second, laterally inward portion of the engagement structure. A carrier may include supports shaped, positioned, and configured to be positioned in the second portions of the engagement structures to secure the end of the substrate to the carrier. ## Claims ### Claim 1 An apparatus, comprising: a substrate supporting at least one semiconductor device thereon, the substrate comprising: an interface located proximate to an end of the substrate and sized, shaped, and configured to provide external electrical connection to the at least one semiconductor device; and engagement structures located proximate to, and laterally outward from, the interface, the engagement structures extending laterally beyond a longitudinal remainder of a lateral periphery of the substrate trailing the engagement structures, each engagement structure comprising a first depth at a first portion of the engagement structure and a second, smaller depth at a second, laterally inward portion of the engagement structure to define a recess therebetween; and a carrier comprising supports shaped, positioned, and configured to be positioned in the recesses of the engagement structures to secure the end of the substrate to the carrier. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the carrier comprises a crossbar for positioning proximate to another, opposite end of the substrate and sidewalls extending longitudinally from the crossbar for placement along the remainder of the lateral periphery of the substrate. ### Claim 3 (depends on 2) The apparatus of claim 2, wherein the supports comprise cutouts in the sidewalls, the cutouts positioned for alignment with the engagement structures of the substrate. ### Claim 4 (depends on 3) The apparatus of claim 3, further comprising a post spanning each cutout, each post sized, positioned, oriented, and configured to be received in a recess proximate to the second portion of the engagement structure to secure the end of the substrate to the carrier. ### Claim 5 (depends on 2) The apparatus of claim 2, further comprising holes extending through the crossbar, the holes sized and shaped to receive connectors through the holes to secure the carrier in place in a higher-level assembly. ### Claim 6 (depends on 2) The apparatus of claim 2, wherein a greatest width of the crossbar, as measured in a direction at least substantially perpendicular to major surfaces of the sidewalls, is equal to or less than 1U of a server rack. ### Claim 7 (depends on 2) The apparatus of claim 2, wherein the greatest width of the crossbar is equal to or less than 34 mm. ### Claim 8 (depends on 1) The apparatus of claim 1, further comprising holes extending through the substrate, the holes located proximate to another, opposite end of the substrate. ### Claim 9 (depends on 8) The apparatus of claim 8, wherein the carrier comprises protrusions extending laterally inwardly from each sidewall toward each other sidewall, the protrusions comprising other holes extending through the protrusions, the other holes positioned to align with the holes in the substrate when the engagement structures are engaged with the supports. ### Claim 10 (depends on 1) The apparatus of claim 1, wherein the at least one semiconductor device comprises a first semiconductor device supported on a first major surface of the substrate and a second semiconductor device supported on a second major surface of the substrate, the first major surface located on a first side of the substrate, the second major surface located on a second, opposite side of the substrate. ### Claim 11 (depends on 10) The apparatus of claim 10, further comprising heat-management structures, each heat management structure located on a side of a respective one of the first semiconductor device or the second semiconductor device opposite the substrate. ### Claim 12 (depends on 10) The apparatus of claim 10, further comprising an overmold material covering at least the first semiconductor device and the second semiconductor device. ### Claim 13 (depends on 12) The apparatus of claim 12, wherein the overmold material covers a majority of each of the first major surface and the second major surface. ### Claim 14 (depends on 4) The apparatus of claim 4, wherein each sidewall comprises longitudinally extending mutually parallel rails defining a channel therebetween aligned with the cutouts, lateral edges of the substrate being received in the channels and the posts received in recesses of the engagement structures. ### Claim 15 A system, comprising: a central processing unit connected to at least one memory device, the at least one memory device comprising a substrate supporting memory chips thereon, the substrate comprising: an edge connector at a longitudinal end of the substrate sized, shaped, and configured to provide external electrical connections for the memory devices; and hook-shaped engagement structures located proximate to, and laterally outward from and longitudinally trailing the edge connector, the engagement structures extending laterally beyond a lateral periphery of the substrate trailing the engagement structures, each engagement structure defining a recess; and a carrier comprising cutouts shaped, positioned, and configured to receive the hook-shaped engagement structures at least partially therein and posts located within the cutouts, the posts sized, positioned, and configured to be positioned in the recesses of the engagement structures to secure the end of the substrate to the carrier. ### Claim 16 A method, comprising: orienting a substrate comprising an interface located proximate to an end of the substrate such that another, opposite end of the substrate is proximate a crossbar of a carrier, the substrate supporting at least one semiconductor device thereon, the interface sized, shaped, and configured to provide external electrical connection to the at least one semiconductor device; and securing the end of the substrate to the carrier by engaging engagement structures located proximate to, and laterally outward from, the interface with supports of the carrier, the engagement structures extending laterally beyond a remainder of a lateral periphery of the substrate, each engagement structure comprising a first depth at a first portion of the engagement structure and a second, smaller depth at a second, laterally inward portion of the engagement structure, the supports being positioned laterally within the second portions of the engagement structures when the engagement structures are engaged with the supports. ### Claim 17 (depends on 16) The method of claim 16, wherein engaging the engagement structures with the support comprises positioning a post of each support proximate to the second portions of the engagement structures, each post spanning a cutout in a respective sidewall of the carrier extending from the crossbar along the remainder of the lateral periphery of the substrate. ### Claim 18 (depends on 17) The method of claim 17, further comprising inserting the substrate longitudinally into the carrier between the sidewalls, surfaces defining the cutouts located proximate to ends of the posts and aligned with channels between longitudinally extending, laterally inwardly protruding rails of the sidewalls, the channels each receiving a lateral edge of the substrate. ### Claim 19 (depends on 16) The method of claim 16, further comprising aligning holes extending through the substrate with other holes extending through protrusions of the carrier, the holes of the substrate located proximate to another, opposite end of the substrate, each protrusion extending from a respective sidewall of the carrier toward another respective sidewall, each protrusion comprising one of the other holes extending through the protrusion, each respective sidewall extending from the crossbar along the remainder of the lateral periphery of the substrate. ### Claim 20 (depends on 19) The method of claim 19, further comprising securing the other end of the substrate to the carrier by inserting an attachment member through each set of a hole of the substrate and another hole of a respective protrusion of the carrier. ### Claim 21 (depends on 16) The method of claim 16, further comprising securing the carrier within an equipment rack of a server. ### Claim 22 A carrier for a memory module, comprising: a crossbar extending laterally between mutually parallel sidewalls at one end of the carrier; mutually parallel rails defining channels extending longitudinally from proximate the crossbar to proximate an opposing end of the carrier; a support structure comprising a post extending vertically between the rails of each sidewall in a channel, the support structure further comprising a cutout in an adjacent sidewall laterally outwardly of the post; and protrusions proximate the crossbar and extending laterally inwardly from each sidewall, the protrusions extending inwardly of a channel of the respective sidewall of the protrusion, each protrusion having a vertical aperture therethrough positioned for alignment with an aperture of a memory module having lateral edges received within the channel and recesses of laterally outwardly protruding engagement structures of the substrate receiving the posts therein. ### Claim 23 A memory module, comprising: a substrate bearing multiple memory chips on at least one side thereof; the substrate having an interconnect in the form of an edge connector at one end thereof in communication with the multiple memory chips through conductive traces and vias carried by a dielectric material of the substrate; engagement structures on opposing edges of the substrate longitudinally trailing the interconnect and extending laterally outwardly therefrom, the engagement structures comprising hooks defining recesses opening to the rear of the engagement structures; a portion of the substrate trailing the engagement structures of a lesser width than a width of the substrate at the engagement structures; and apertures proximate an end of the substrate opposite the interconnect adjacent opposing edges of the substrate.