# US 2022/0045592 A1 · Liquid heat exchanger for electronic device

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- Number: US 2022/0045592 A1
- Document ID: US20220045592A1
- Status: Published application
- Kind: A1
- Application number: 16/988,558
- Filed: 2020-08-07
- Published: 2022-02-10
- Earliest claimed: 2020-08-07
- Assignees: Apple Inc.
- Applicants: Apple Inc.
- Inventors: Xiaoyi HUANG
- Web page: https://patentgrep.com/patent/US20220045592A1

## CPC

- H02K 44/04: Conduction pumps
- G06F 1/1615: {with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function (constructional details of portable telephones comprising a plurality of mechanically joined movable body parts H04M1/0206)}
- G06F 1/1626: {with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]}
- G06F 1/163: {Wearable computers, e.g. on a belt}
- G06F 1/203: {for portable computers, e.g. for laptops}
- H02K 44/085: {with conducting liquids}
- H05K 7/20272: {Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds}
- F04D 13/027: {Details of the magnetic circuit}
- H02K: DYNAMO-ELECTRIC MACHINES (dynamo-electric relays H01H53/00; conversion of DC or AC input power into surge output power {H03K3/53})
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- F04D: NON-POSITIVE-DISPLACEMENT PUMPS (engine fuel-injection pumps F02M; ion pumps H01J41/12; electrodynamic pumps H02K44/02)

## Abstract

In some examples, a system can include an electronic device and a cooling system that transfers heat among other components of the system. The cooling system can include a pipe that contains a fluid, for example. In some examples, the cooling system can further include a magnetic piston, one or more electromagnetic coils, and a power supply. The electromagnetic coils and power supply can generate a magnetic field that moves the piston to cause the fluid to circulate in the fluid pipe. In some examples, the cooling system can further include a magnet and one or more pairs of electrodes coupled to a power supply. The magnet, electrodes, and power supply can generate a Lorentz force that causes a conductive fluid to circulate in the fluid pipe.

## Claims

### Claim 1

A system comprising:
an electronic device, the electronic device including a housing and a first component;
a cooling system, the cooling system comprising:
a pipe containing a conductive fluid, wherein a first location of the pipe is thermally coupled to the housing of the electronic device and a second location of the pipe is thermally coupled to the first component of the electronic device;
a magnet configured to generate a magnetic field at a third location of the pipe; and
a power supply coupled to two electrodes, the power supply and the electrodes configured to generate an electrical current through the conductive fluid at the third location of the pipe, wherein the magnet, power supply, and electrodes are configured to create a Lorentz force that acts on the conductive fluid at the third location of the pipe.

### Claim 2 (depends on 1)

The system of claim 1, wherein the pipe includes an electrically conductive material coupled to a reference voltage.

### Claim 3 (depends on 1)

The system of claim 1, wherein the first component of the electronic device is located at the third location along the pipe.

### Claim 4 (depends on 1)

The system of claim 1, wherein the housing of the electronic device is located at the third location along the pipe.

### Claim 5 (depends on 1)

The system of claim 1, wherein the power supply is configured to supply a direct current (DC) voltage to the two electrodes.

### Claim 6 (depends on 1)

The system of claim 1, wherein the pipe is a first pipe and the electrodes are first electrodes, and the system further comprises:
a second pipe containing the conductive fluid, wherein a first location of the second pipe is thermally coupled to the housing of the electronic device and a second location of the second pipe is thermally coupled to the first component of the electronic device; and
two second electrodes coupled to the power supply, wherein the power supply and two second electrodes are configured to generate a second electrical current through the conductive fluid at a third location of the second pipe.

### Claim 7 (depends on 6)

The system of claim 6, wherein:
the first electrodes are configured to generate a current that creates a Lorentz force in a first direction, and
the second electrodes are configured to generate a current that creates a Lorentz force in a second direction, opposite the first direction.

### Claim 8

A cooling system comprising:
a pipe containing a conductive fluid, wherein a first location of the pipe is thermally coupled to a housing of an electronic device and a second location of the pipe is thermally coupled to a first component of the electronic device;
a magnet configured to generate a magnetic field at a third location of the pipe; and
a power supply coupled to two electrodes, the power supply and the electrodes configured to generate an electrical current through the conductive fluid at the third location of the pipe, wherein the magnet, power supply, and electrodes are configured to create a Lorentz force that acts on the conductive fluid at the third location of the pipe.

### Claim 9 (depends on 8)

The cooling system of claim 8, wherein the pipe includes an electrically conductive material coupled to a reference voltage.

### Claim 10 (depends on 8)

The cooling system of claim 8, wherein the pipe is configured to couple to the first component of the electronic device at the third location along the pipe.

### Claim 11 (depends on 8)

The cooling system of claim 8, wherein the pipe is configured to couple to the housing of the electronic device at the third location along the pipe.

### Claim 12 (depends on 8)

The cooling system of claim 8, wherein the power supply is configured to supply a direct current (DC) voltage to the two electrodes.

### Claim 13 (depends on 8)

The cooling system of claim 8, wherein the pipe is a first pipe and the electrodes are first electrodes, and the system further comprises:
a second pipe containing the conductive fluid, wherein a first location of the second pipe is thermally coupled to the housing of the electronic device and a second location of the second pipe is thermally coupled to the first component of the electronic device; and
two second electrodes coupled to the power supply, wherein the power supply and two second electrodes are configured to generate a second electrical current through the conductive fluid at a third location of the second pipe.

### Claim 14 (depends on 13)

The system of claim 13, wherein:
the first electrodes are configured to generate a current that creates a Lorentz force in a first direction, and
the second electrodes are configured to generate a current that creates a Lorentz force in a second direction, opposite the first direction.

### Claim 15

A system comprising:
an electronic device, the electronic device including a housing and a first component;
a cooling system, the cooling system comprising:
a pipe containing a fluid;
a piston housing coupled to the pipe;
a magnetic piston disposed within the piston housing;
a power supply;
an electromagnetic coil coupled to a surface of the piston housing and coupled to the power supply, wherein the power supply and electromagnetic coil are configured to generate a variable magnetic field that causes motion of the piston in the piston housing.

### Claim 16 (depends on 15)

The system of claim 15, wherein the power supply is configured to generate an alternating current (AC) signal, the electromagnetic coil is configured to generate an alternating magnetic field, and the piston is configured to move in alternating directions and cause movement of the fluid in alternating directions in the fluid pipe.

### Claim 17 (depends on 15)

The system of claim 15, wherein the first component of the electronic device is thermally coupled to the piston housing of the cooling system.

### Claim 18 (depends on 15)

The system of claim 15, wherein the housing of the electronic device is thermally coupled to the piston housing of the cooling system.

### Claim 19 (depends on 15)

The system of claim 15, wherein the electromagnetic coil is a first electromagnetic coil, and the system further comprises:
a second magnetic coil coupled to a surface of the piston housing that is opposite from the surface of the piston housing to which the first magnetic coil is coupled, the second magnetic coil being coupled to the power supply, wherein the second magnetic coil is configured to generate a second variable magnetic field that causes motion of the piston in the piston housing.

### Claim 20 (depends on 19)

The system of claim 19, wherein:
the first electromagnetic coil is configured to generate the variable magnetic field in a direction that is the same as a direction of the second magnetic field generated by the second electromagnetic coil.