# US 2022/0045477 A1 · Fixing base, laser projection module, and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2022/0045477 A1 - Document ID: US20220045477A1 - Status: Published application - Kind: A1 - Application number: 17/508,834 - Filed: 2021-10-22 - Published: 2022-02-10 - Earliest claimed: 2019-04-23 - Assignees: Vivo Mobile Communication Co., Ltd. - Applicants: Vivo Mobile Communication Co., Ltd. - Inventors: Wanglai Yang - Web page: https://patentgrep.com/patent/US20220045477A1 ## CPC - H01S 5/02326: Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses - H01S 5/06825: {Protecting the laser, e.g. during switch-on/off, detection of malfunctioning or degradation} - H01S 5/02253: using lenses - H01S 5/02345: Wire-bonding - H01S 5/0237: by soldering - H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC} - H01S 5/02208: characterised by the shape of the housings - H01S 5/02257: using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL ## Abstract A laser projection module includes a fixing base, a light-emitting chip and an optical element. The fixing base has a first surface and a second surface opposite each other, and the second surface is a light-emitting surface. The fixing base has a first accommodation cavity, a second accommodation cavity and a third accommodation cavity that are sequentially arranged in a direction from the first surface to the second surface and communicated to each other. The fixing base is provided with a conduction line. The light-emitting chip is disposed on the first fixing surface of the fixing base and electrically connected to one terminal of the conduction line. The optical element is disposed on the second fixing surface of the fixing base. ## Claims ### Claim 1 A laser projection module, comprising: a fixing base having a first surface and a second surface that are disposed oppositely in a height direction of the fixing base, wherein the second surface is a light-emitting surface, the fixing base has a first accommodation cavity, a second accommodation cavity, and a third accommodation cavity that are sequentially distributed in a direction from the first surface to the second surface and communicated to each other, a projection area of the second accommodation cavity on the second surface is greater than a projection area of the third accommodation cavity on the second surface and is smaller than a projection area of the first accommodation cavity on the second surface, a first inner wall of the fixing base is connected to a second inner wall of the fixing base via a first fixing surface, the second inner wall is connected to a third inner wall of the fixing base via a second fixing surface, the first inner wall is formed by the first accommodation cavity in the fixing base, the second inner wall is formed by the second accommodation cavity in the fixing base, the third inner wall is formed by the third accommodation cavity in the fixing base, and the fixing base is provided with a conduction line; a light-emitting chip disposed on the first fixing surface of the fixing base and electrically connected to one terminal of the conduction line; and an optical element disposed on the second fixing surface of the fixing base, wherein after passing through the optical element, laser light emitted by the light-emitting chip is projected out of the fixing base through the third accommodation cavity. ### Claim 2 (depends on 1) The laser projection module according to claim 1, wherein shapes of orthogonal projections of the first accommodation cavity, the second accommodation cavity, and the third accommodation cavity on the second surface are square or circular. ### Claim 3 (depends on 1) The laser projection module according to claim 1, wherein the first surface of the fixing base is provided with an electrode or coated with an electrically conductive material. ### Claim 4 (depends on 1) The laser projection module according to claim 1, wherein the laser projection module further comprises a substrate electrically connected to the first surface of the fixing base, and a surface of the substrate facing away from the fixing base is provided with an electrode or coated with an electrically conductive material. ### Claim 5 (depends on 1) The laser projection module according to claim 1, wherein one side of the light-emitting chip away from the first fixing surface is provided with a heat dissipation material or a thermal conductive material. ### Claim 6 (depends on 4) The laser projection module according to claim 4, wherein a surface of the substrate facing the light-emitting chip is provided with a thermal pad extending towards the light-emitting chip; or a heat dissipation hole is formed in the substrate and filled with a thermal conductive material; or the substrate is a plate made of a thermal conductive material. ### Claim 7 (depends on 1) The laser projection module according to claim 1, wherein the light-emitting chip is welded on the first fixing surface of the fixing base by using a spherical solder or a copper pillar having a dome-shaped solder at the top. ### Claim 8 (depends on 1) The laser projection module according to claim 1, wherein the fixing base is a structural member made of a ceramic material or a resin material; or the fixing base is a structural member made by embedding a metal frame into a ceramic material or a resin material. ### Claim 9 A fixing base, applied to a laser projection module, wherein the fixing base has a first surface and a second surface that are disposed oppositely in a height direction of the fixing base; the second surface is a light-emitting surface; the fixing base has a first accommodation cavity, a second accommodation cavity, and a third accommodation cavity that are sequentially distributed in a direction from the first surface to the second surface and communicated to each other; a projection area of the second accommodation cavity on the second surface is greater than a projection area of the third accommodation cavity on the second surface and is smaller than a projection area of the first accommodation cavity on the second surface; a first inner wall of the fixing base is connected to a second inner wall of the fixing base via a first fixing surface; the second inner wall is connected to a third inner wall of the fixing base via a second fixing surface; the first inner wall is formed by the first accommodation cavity in the fixing base; the second inner wall is formed by the second accommodation cavity in the fixing base; the third inner wall is formed by the third accommodation cavity in the fixing base; and the fixing base is provided with a conduction line. ### Claim 10 (depends on 9) The fixing base according to claim 9, wherein shapes of orthogonal projections of the first accommodation cavity, the second accommodation cavity, and the third accommodation cavity on the second surface are square or circular. ### Claim 11 (depends on 9) The fixing base according to claim 9, wherein the first surface of the fixing base is provided with an electrode or coated with an electrically conductive material. ### Claim 12 An electronic device, comprising a laser projection module, wherein the electronic device comprises: a fixing base having a first surface and a second surface that are disposed oppositely in a height direction of the fixing base, wherein the second surface is a light-emitting surface, the fixing base has a first accommodation cavity, a second accommodation cavity, and a third accommodation cavity that are sequentially distributed in a direction from the first surface to the second surface and communicated to each other, a projection area of the second accommodation cavity on the second surface is greater than a projection area of the third accommodation cavity on the second surface and is smaller than a projection area of the first accommodation cavity on the second surface, a first inner wall of the fixing base is connected to a second inner wall of the fixing base via a first fixing surface, the second inner wall is connected to a third inner wall of the fixing base via a second fixing surface, the first inner wall is formed by the first accommodation cavity in the fixing base, the second inner wall is formed by the second accommodation cavity in the fixing base, the third inner wall is formed by the third accommodation cavity in the fixing base, and the fixing base is provided with a conduction line; a light-emitting chip, disposed on the first fixing surface of the fixing base and electrically connected to one terminal of the conduction line; and an optical element, disposed on the second fixing surface of the fixing base, wherein after passing through the optical element, laser light emitted by the light-emitting chip is projected out of the fixing base through the third accommodation cavity. ### Claim 13 (depends on 12) The electronic device according to claim 12, wherein shapes of orthogonal projections of the first accommodation cavity, the second accommodation cavity, and the third accommodation cavity on the second surface are square or circular. ### Claim 14 (depends on 12) The electronic device according to claim 12, wherein the first surface of the fixing base is provided with an electrode or coated with an electrically conductive material. ### Claim 15 (depends on 12) The electronic device according to claim 12, wherein the laser projection module further comprises a substrate electrically connected to the first surface of the fixing base, and a surface of the substrate facing away from the fixing base is provided with an electrode or coated with an electrically conductive material. ### Claim 16 (depends on 12) The electronic device according to claim 12, wherein one side of the light-emitting chip away from the first fixing surface is provided with a heat dissipation material or a thermal conductive material. ### Claim 17 (depends on 15) The electronic device according to claim 15, wherein a surface of the substrate facing the light-emitting chip is provided with a thermal pad extending towards the light-emitting chip; or a heat dissipation hole is formed in the substrate and filled with a thermal conductive material; or the substrate is a plate made of a thermal conductive material. ### Claim 18 (depends on 12) The electronic device according to claim 12, wherein the light-emitting chip is welded on the first fixing surface of the fixing base by using a spherical solder or a copper pillar having a dome-shaped solder at the top. ### Claim 19 (depends on 12) The electronic device according to claim 12, wherein the fixing base is a structural member made of a ceramic material or a resin material; or the fixing base is a structural member made by embedding a metal frame into a ceramic material or a resin material.