# US 2022/0045253 A1 · Light emitting diode packages > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2022/0045253 A1 - Document ID: US20220045253A1 - Status: Published application - Kind: A1 - Application number: 17/507,201 - Filed: 2021-10-21 - Published: 2022-02-10 - Earliest claimed: 2019-01-16 - Assignees: CreeLED, Inc. - Applicants: CreeLED, Inc. - Inventors: Arthur F. Pun; Colin Blakely; Kyle Damborsky; Jae-Hyung Jeremiah Park - Web page: https://patentgrep.com/patent/US20220045253A1 ## CPC - H10H 20/8506: {Containers} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/825: containing nitrogen, e.g. GaN - H10H 20/8582: {characterised by their shape} - H10H 20/8585: {being an interconnection} - H10W 90/00: Package configurations - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Solid-state lighting devices including light-emitting diodes (LEDs) and LED packages are disclosed. LED packages are provided with improved thermal and/or electrical coupling between LED chips and submounts or lead frames. Various configurations of submounts with via arrangements are disclosed to provide improved coupling between LED chips and submounts. LED chip contacts are disclosed with one or more openings that are registered with vias to provide more uniform mounting. Multiple LED chips may be arranged around a thermally conductive element on a submount, and a via in the submount may be registered with the thermally conductive element. Subassemblies are provided between LED chips and lead frames to improve electrical and thermal coupling. Underfill materials may be arranged between LED chips and lead frames to provide improved mechanical support. ## Claims ### Claim 1 A light emitting diode (LED) package comprising: an LED chip mounted to a lead frame; a underfill material arranged between the LED chip and the lead frame; and an encapsulant material arranged on the LED chip and the underfill material. ### Claim 2 (depends on 1) The LED package of claim 1, wherein a first contact of the LED chip is electrically and mechanically coupled with a first lead frame portion, and a second contact of the LED chip is electrically and mechanically coupled with a second lead frame portion. ### Claim 3 (depends on 2) The LED package of claim 2, wherein the underfill material is arranged between the first lead frame portion and the second lead frame portion. ### Claim 4 (depends on 2) The LED package of claim 2, wherein the underfill material is arranged between the first contact of the LED chip and the second contact of the LED chip. ### Claim 5 (depends on 1) The LED package of claim 1, wherein the underfill material is arranged between lateral edges of the LED chip and the lead frame. ### Claim 6 (depends on 1) The LED package of claim 1, wherein the underfill material comprises light-altering particles. ### Claim 7 (depends on 6) The LED package of claim 6, wherein the light-altering particles comprise titanium dioxide (TiO2) particles that are suspended in a binder. ### Claim 8 (depends on 7) The LED package of claim 7, wherein the binder comprises silicone. ### Claim 9 (depends on 1) The LED package of claim 1, wherein the underfill material comprises epoxy. ### Claim 10 (depends on 1) The LED package of claim 1, wherein the underfill material comprises a material with a higher durometer value on a Shore D hardness scale than the encapsulant material. ### Claim 11 (depends on 1) The LED package of claim 1, wherein the underfill material comprises a material with a durometer value on a Shore D hardness scale of at least 40. ### Claim 12 (depends on 11) The LED package of claim 11, wherein the durometer value is in a range from 40 to 100. ### Claim 13 (depends on 1) The LED package of claim 1, further comprising an insulating material on the lead frame, wherein the insulating material forms sidewalls of a cup in which the LED chip is arranged, and wherein the underfill material is arranged between the sidewalls of the cup. ### Claim 14 A light emitting diode (LED) package comprising: an LED chip mounted to a lead frame; and a subassembly arranged between the LED chip and the lead frame, wherein the subassembly comprises a metal submount that is thermally coupled between the LED chip and the lead frame. ### Claim 15 (depends on 14) The LED package of claim 14, wherein the subassembly further comprises: a first die attach pad that is configured to be electrically coupled with a first contact pad of the LED chip; and a second die attach pad that is configured to be electrically coupled with a second contact pad of the LED chip. ### Claim 16 (depends on 15) The LED package of claim 15, wherein the first die attach pad and the second die attach pad are electrically coupled to different portions of the lead frame by wirebonds. ### Claim 17 (depends on 15) The LED package of claim 15, wherein the subassembly further comprises a dielectric layer arranged between the first die attach pad and the metal submount and arranged between the second die attach pad and the metal submount. ### Claim 18 (depends on 15) The LED package of claim 15, wherein the LED chip is arranged in a flip-chip configuration on the first die attach pad and the second die attach pad. ### Claim 19 (depends on 14) The LED package of claim 14, further comprising an underfill material arranged between the subassembly and the lead frame. ### Claim 20 (depends on 14) The LED package of claim 14, further comprising an insulating material on the lead frame, wherein the insulating material forms sidewalls of a cup in which the LED chip and the subassembly are arranged. ### Claim at position 21 21-39. (canceled)