# US 2022/0045249 A1 · Optoelectronic semiconductor component having a first and second metal layer and method for producing the optoelectronic semiconductor component

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- Number: US 2022/0045249 A1
- Document ID: US20220045249A1
- Status: Published application
- Kind: A1
- Application number: 17/275,672
- Filed: 2019-09-12
- Published: 2022-02-10
- Earliest claimed: 2018-09-14
- Assignees: OSRAM OLED GmbH
- Applicants: OSRAM OLED GmbH
- Inventors: Christian Eichinger; Korbinian Perzlmaier
- Web page: https://patentgrep.com/patent/US20220045249A1

## CPC

- H10H 20/835: {Reflective materials}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/01: Manufacture or treatment
- H10H 20/819: characterised by their shape, e.g. curved or truncated substrates
- H10H 20/856: Reflecting means
- H10H 20/032: {of electrodes}
- H10H 20/0364: {of interconnections}
- H10H 20/831: characterised by their shape
- H10H 20/841: Reflective coatings, e.g. dielectric Bragg reflectors
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

An optoelectronic semiconductor component may include a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and an active zone, wherein the first semiconductor layer and the second semiconductor layer are patterned to form a mesa so that parts of the second semiconductor layer are not covered by the first semiconductor layer and a portion of the active zone is exposed in the area of a mesa flank. The optoelectronic semiconductor component may include a passivation layer arranged over parts of the first semiconductor layer and over parts of the second semiconductor layer and over the exposed portion of the active zone. The optoelectronic semiconductor component furthermore contains a first metal layer and a second metal layer. The second metal layer covers the passivation layer in the area of the mesa flank.

## Claims

### Claim 1

An optoelectronic semiconductor component comprising:
a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and an active zone wherein:
the first semiconductor layer is arranged over the second semiconductor layer, the active zone is arranged between the first and second semiconductor layer and the first semiconductor layer and the second semiconductor layer are patterned to form a mesa so that parts of the second semiconductor layer are free from the first semiconductor layer and a portion of the active zone is exposed in the area of a mesa flank;
a passivation layer arranged over parts of the first semiconductor layer and over parts of the second semiconductor layer and over the exposed portion of the active zone;
a first metal layer electrically connected to the first semiconductor layer, and a second metal layer electrically connected to the second semiconductor layer;
wherein the second metal layer covers the passivation layer in the area of the mesa flank and a composition of the first metal layer adjacent to the first semiconductor layer is constant in a horizontal direction; and
the first metal layer directly adjoins the first semiconductor layer and a lateral positioning of the first metal layer differs by less than 100 nm from the lateral positioning of the patterned first semiconductor layer.

### Claim 2 (depends on 1)

The optoelectronic semiconductor component according to claim 1, wherein a metal of the first or second metal layer is selected from the group consisting of rhodium, platinum, gold, nickel, chromium, palladium, or combinations thereof.

### Claim 3 (depends on 1)

The optoelectronic semiconductor component according to claim 1, wherein a metal of the first metal layer comprises rhodium, the second metal layer comprises palladium, or combinations thereof.

### Claim 4

(canceled)

### Claim 5 (depends on 1)

The optoelectronic semiconductor component according to claim 1, wherein a horizontally extending part of the second metal layer is arranged over the first metal layer.

### Claim 6 (depends on 1)

The optoelectronic semiconductor component according to any claim 1, further comprising a metallic mirror layer electrically insulated from the second semiconductor layer and where the second metal layer is arranged over part of the second semiconductor layer.

### Claim 7 (depends on 6)

The optoelectronic semiconductor component according to claim 6, wherein a metal of the metallic mirror layer is selected from the group consisting of rhodium, platinum, gold, nickel, chromium, palladium, or combinations thereof.

### Claim 8 (depends on 6)

The optoelectronic semiconductor component according to claim 6, wherein the metallic mirror layer is connected to the first metal layer.

### Claim 9 (depends on 1)

The optoelectronic semiconductor component according to claim 1, wherein the first metal layer is laterally at least partially surrounded by the second metal layer, the metallic mirror layer, or a combination thereof.

### Claim 10

An optoelectronic semiconductor component, comprising:
a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and an active zone, wherein:
the first semiconductor layer is arranged over the second semiconductor layer, the active zone is arranged between the first and second semiconductor layer and the first semiconductor layer and the second semiconductor layer are patterned to form a mesa so that parts of the second semiconductor layer are free from the first semiconductor layer and a portion of the active zone is exposed in the area of a mesa flank;
a passivation layer arranged over parts of the first semiconductor layer and over parts of the second semiconductor layer as well as over the exposed portion of the active zone;
a first metal layer electrically connected to the first semiconductor layer; and
a second metal layer electrically connected to the second semiconductor layer, and wherein the first metal layer or a metallic mirror layer electrically separate from the second metal layer covers the passivation layer in the area of the mesa flank.

### Claim 11 (depends on 10)

The optoelectronic semiconductor component according to claim 10, wherein a metal of the first metal layer comprises rhodium, the second metal layer comprises palladium, or combinations thereof.

### Claim 12 (depends on 10)

The optoelectronic semiconductor component according to claim 10, wherein a lateral positioning of the first metal layer differs by less than 100 nm from the lateral positioning of the patterned first semiconductor layer.

### Claim 13 (depends on 10)

The optoelectronic semiconductor component according to claim 10, wherein the metallic mirror layer is connected to the first metal layer.

### Claim 14 (depends on 13)

The optoelectronic semiconductor component according to claim 13, wherein part of the metallic mirror layer is arranged over part of the second semiconductor layer.

### Claim 15 (depends on 10)

The optoelectronic semiconductor component according to claim 10, wherein a lateral size of the optoelectronic semiconductor component is less than 70 μm.

### Claim 16

A method for producing an optoelectronic semiconductor component, comprising:
forming a semiconductor layer stack comprising a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type and an active zone, the active zone being arranged between the first and second semiconductor layers;
patterning a mesa so that parts of the second semiconductor layer are free from the first semiconductor layer and a portion of the active zone is exposed in the area of a mesa flank;
forming a passivation layer over parts of the first semiconductor layer, over parts of the second semiconductor layer and over the exposed portion of the active zone; forming a first metal layer electrically connected to the first semiconductor layer;
forming a second metal layer electrically connected to the second semiconductor layer,
wherein the second metal layer covers the passivation layer in the area of the mesa flank and a composition of the first metal layer adjacent to the first semiconductor layer is constant in a horizontal direction,
wherein the first metal layer directly adjoins the first semiconductor layer and a lateral positioning of the first metal layer differs by less than 100 nm from the lateral positioning of the patterned first semiconductor layer.

### Claim 17

(canceled)

### Claim 18 (depends on 16, 17)

The method according to claim 16 or 17, further comprising:
etching a part of the first metal layer to obtain a patterned first metal layer;
wherein the first semiconductor layer is patterned using the patterned first metal layer as an etching mask.

### Claim at position 19

19-20. (canceled)