# US 2022/0045237 A1 · Magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting element > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2022/0045237 A1 - Document ID: US20220045237A1 - Status: Published application - Kind: A1 - Application number: 17/022,511 - Filed: 2020-09-16 - Published: 2022-02-10 - Earliest claimed: 2020-08-05 - Assignees: Ingentec Corporation - Applicants: Ingentec Corporation - Inventors: HSIANG-AN FENG; CHIA-WEI TU; CHENG-YU CHUNG; YA-LI CHEN - Web page: https://patentgrep.com/patent/US20220045237A1 ## CPC - H10H 20/01: Manufacture or treatment - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H01F 1/14708: {Fe-Ni based alloys (pure Fe or Ni H01F1/14, H01F1/16 or H01F1/20)} - H01F 41/34: in patterns, e.g. by lithography - H10W 90/00: Package configurations - H10H 20/032: {of electrodes} - H10H 20/0364: {of interconnections} - H10H 20/832: characterised by their material - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting element are provided. The fabrication method comprises providing a magnetic metal composite substrate, wherein a second metal layer is respectively disposed on an upper and lower surface of a first metal layer; forming a connecting metal layer, an epitaxial layer and a plurality of electrode unit on top; and performing a complex process, which removes the second metal layer on the lower surface of the first metal layer and part of the first metal layer and performs cutting according to the number of the electrode unit, so as to form a plurality of epitaxial die. Each epitaxial die corresponds to an electrode unit to form a magnetic light-emitting element. The proposed method improves soft magnetic properties of an original substrate and enables dies to reverse spontaneously, thereby used perfectly for industrial mass transfer technology. ## Claims ### Claim 1 A fabrication method for manufacturing a magnetic light-emitting element, comprising: providing a magnetic metal composite substrate, comprising a first metal layer and two second metal layers, wherein each of the second metal layers is respectively disposed on an upper surface and a lower surface of the first metal layer; forming a connecting metal layer on the magnetic metal composite substrate and an epitaxial layer on the connecting metal layer; providing a plurality of electrode unit on a top surface of the epitaxial layer; and performing a complex process, which comprises removing the second metal layer which is located on the lower surface of the first metal layer and part of the first metal layer as well as performing cutting according to the number of the plurality of electrode unit, so as to form a plurality of epitaxial die, wherein each the epitaxial die corresponds to each the electrode unit to form the magnetic light-emitting element according to each the epitaxial die. ### Claim 2 (depends on 1) The fabrication method for manufacturing a magnetic light-emitting element of claim 1, wherein the magnetic light-emitting element is employed with wire bonding and packaging to form a vertical type light emitting diode die, and the vertical type light emitting diode die is able to have an initial magnetic permeability. ### Claim 3 (depends on 2) The fabrication method for manufacturing a magnetic light-emitting element of claim 2, wherein the magnetic metal composite substrate generates a micro current and transmits the micro current to the epitaxial layer due to the initial magnetic permeability. ### Claim 4 (depends on 2) The fabrication method for manufacturing a magnetic light-emitting element of claim 2, wherein the first metal layer and the second metal layer are combined through cutting, vacuum heating, and grinding or polishing to form the magnetic metal composite substrate, such that the magnetic metal composite substrate has a high thermal conductivity, low thermal expansion coefficient and the initial magnetic permeability. ### Claim 5 (depends on 1) The fabrication method for manufacturing a magnetic light-emitting element of claim 1, wherein a thickness proportion of the second metal layer to the first metal layer to the second metal layer in the magnetic metal composite substrate ranges from 1:3:1 to 1:9:1. ### Claim 6 (depends on 1) The fabrication method for manufacturing a magnetic light-emitting element of claim 1, wherein a material of the first metal layer in the magnetic metal composite substrate is nickel-iron alloy. ### Claim 7 (depends on 1) The fabrication method for manufacturing a magnetic light-emitting element of claim 1, wherein a material of the second metal layer in the magnetic metal composite substrate is copper. ### Claim 8 (depends on 1) The fabrication method for manufacturing a magnetic light-emitting element of claim 1, wherein the complex process comprises: performing a cutting process, in which the cutting process performs dividing according to the number of the plurality of electrode unit, the cutting process is applied to the epitaxial layer, the connecting metal layer and the magnetic metal composite substrate to form the plurality of epitaxial die, such that each the epitaxial die corresponds to each the electrode unit, the cutting process includes a cutting end point, and the cutting end point is configured in the first metal layer of the magnetic metal composite substrate; and performing an etching process, which removes the second metal layer which is located on the lower surface of the first metal layer and part of the first metal layer, such that the magnetic light-emitting element is formed according to each the epitaxial die. ### Claim 9 (depends on 8) The fabrication method for manufacturing a magnetic light-emitting element of claim 8, wherein the cutting process is implemented through a laser cutting. ### Claim 10 (depends on 9) The fabrication method for manufacturing a magnetic light-emitting element of claim 9, wherein a laser wavelength of the laser cutting is 355 nm to 532 nm, and a cutting depth is 30 microns to 50 microns. ### Claim 11 (depends on 8) The fabrication method for manufacturing a magnetic light-emitting element of claim 8, wherein the etching process is implemented through a wet chemical etching process. ### Claim 12 (depends on 11) The fabrication method for manufacturing a magnetic light-emitting element of claim 11, wherein an etching time for the wet chemical etching process is 10 minutes, and an etching solution is a ferric chloride solution, a mixture of nitric acid (HNO3) and hydrogen peroxide (H2O2), or a mixture of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2). ### Claim 13 (depends on 1) The fabrication method for manufacturing a magnetic light-emitting element of claim 1, wherein the complex process comprises: performing an etching process, which removes the second metal layer which is located on the lower surface of the first metal layer and part of the first metal layer; and performing a cutting process, in which the cutting process performs dividing according to the number of the plurality of electrode unit, the cutting process is applied to the epitaxial layer, the connecting metal layer, the second metal layer which is located on the upper surface of the first metal layer and the remaining first metal layer to form the plurality of epitaxial die, such that each the epitaxial die corresponds to each the electrode unit, and the magnetic light-emitting element is formed according to each the epitaxial die. ### Claim 14 (depends on 13) The fabrication method for manufacturing a magnetic light-emitting element of claim 13, wherein the cutting process is implemented through a laser cutting. ### Claim 15 (depends on 14) The fabrication method for manufacturing a magnetic light-emitting element of claim 14, wherein a laser wavelength of the laser cutting is 355 nm to 532 nm, and a cutting depth is 30 microns to 50 microns. ### Claim 16 (depends on 13) The fabrication method for manufacturing a magnetic light-emitting element of claim 13, wherein the etching process is implemented through a wet chemical etching process. ### Claim 17 (depends on 16) The fabrication method for manufacturing a magnetic light-emitting element of claim 16, wherein an etching time for the wet chemical etching process is 10 minutes, and an etching solution is a ferric chloride solution, a mixture of nitric acid (HNO3) and hydrogen peroxide (H2O2), or a mixture of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2). ### Claim 18 A magnetic light-emitting structure, comprising: a magnetic metal composite substrate; a connecting metal layer, being disposed on the magnetic metal composite substrate; an epitaxial layer, being disposed on the connecting metal layer; a plurality of electrode unit, being disposed on a top surface of the epitaxial layer; a titanium layer, being disposed on a lower surface of the magnetic metal composite substrate; and a gold layer, being disposed on a lower surface of the titanium layer. ### Claim 19 (depends on 18) The magnetic light-emitting structure of claim 18, wherein the magnetic metal composite substrate includes a first metal layer and a second metal layer which is disposed on an upper surface of the first metal layer. ### Claim 20 (depends on 19) The magnetic light-emitting structure of claim 19, wherein a material of the first metal layer is nickel-iron alloy, and a material of the second metal layer is copper. ### Claim 21 (depends on 18) The magnetic light-emitting structure of claim 18, wherein a thickness of the titanium layer is 0.5 μm. ### Claim 22 (depends on 18) The magnetic light-emitting structure of claim 18, wherein a thickness of the gold layer is 1.0 μm.