# US 2022/0045111 A1 · Image sensor package with underfill and image sensor module including the same

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- Number: US 2022/0045111 A1
- Document ID: US20220045111A1
- Status: Published application
- Kind: A1
- Application number: 17/154,890
- Filed: 2021-01-21
- Published: 2022-02-10
- Earliest claimed: 2020-08-07
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Chajea JO; Ohguk KWON; Hyoeun KIM; Seunghoon YEON
- Web page: https://patentgrep.com/patent/US20220045111A1

## CPC

- H10F 39/804: {Containers or encapsulations}
- H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof
- H10F 39/803: {Pixels having integrated switching, control, storage or amplification elements}
- H10F 39/8057: {Optical shielding}
- H10F 39/18: Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F 39/811: {Interconnections}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

An image sensor package comprises: an image sensor chip configured to convert light collected from an outside thereof into an electrical signal; a package substrate disposed under the image sensor chip the package substrate configured to process the electrical signal converted from the image sensor chip; a glass substrate disposed over the image sensor chip while being spaced apart from the image sensor chip; a seal pattern disposed between an upper surface of the package substrate and a lower surface of the glass substrate while surrounding the image sensor chip; and a protection pattern disposed on the package substrate outside the seal pattern, the protection pattern comprising a single-component material, wherein the seal pattern comprises a material different from the material of the protection pattern.

## Claims

### Claim 1

An image sensor package comprising:
an image sensor chip configured to convert light collected from an outside thereof into an electrical signal;
a package substrate disposed under the image sensor chip, the package substrate configured to process the electrical signal converted from the image sensor chip;
a glass substrate disposed over the image sensor chip while being spaced apart from the image sensor chip;
a seal pattern disposed between an upper surface of the package substrate and a lower surface of the glass substrate while surrounding the image sensor chip; and
a protection pattern disposed on the package substrate outside the seal pattern, the protection pattern comprising a single-component material,
wherein the seal pattern comprises a material different from the material of the protection pattern.

### Claim 2 (depends on 1)

The image sensor package of claim 1, wherein the protection pattern surrounds the glass substrate and contacts side surfaces of the glass substrate.

### Claim 3 (depends on 2)

The image sensor package of claim 2, wherein the protection pattern has a maximum height higher than a height of the lower surface of the glass substrate, but lower than a height of an upper surface of the glass substrate with reference to the upper surface of the package substrate.

### Claim 4 (depends on 3)

The image sensor package of claim 3, wherein:
the seal pattern has a thickness of 10 to 50 μm and a width of 30 to 70 μm; and
the glass substrate has a thickness of 300 to 1,000 μm.

### Claim 5 (depends on 1)

The image sensor package of claim 1, wherein an upper surface of the protection pattern is bent.

### Claim 6 (depends on 5)

The image sensor package of claim 5, wherein a height of the upper surface of the protection pattern decreases gradually in a direction receding from the glass substrate.

### Claim 7 (depends on 1)

The image sensor package of claim 1, wherein the protection pattern comprises a thermosetting resin.

### Claim 8 (depends on 7)

The image sensor package of claim 7, wherein the protection pattern has capillary characteristics.

### Claim 9 (depends on 1)

The image sensor package of claim 1, wherein:
the seal pattern comprises
a first sub-pattern disposed on the package substrate, the first sub-pattern having adhesiveness, and
a second sub-pattern disposed on the first sub-pattern, the second sub-pattern comprising a metal;
wherein the first sub-pattern contacts the upper surface of the package substrate; and
wherein the second sub-pattern contacts the lower surface of the glass substrate.

### Claim 10 (depends on 1)

The image sensor package of claim 1, wherein the package substrate comprises a wiring structure layer comprising a plurality of through-silicon via (TSV) contacts vertically extending in the wiring structure layer.

### Claim 11 (depends on 10)

The image sensor package of claim 10, wherein the package substrate further comprises a re-distribution layer disposed under the wiring structure layer, the re-distribution layer comprising a plurality of re-distribution lines, and re-distribution vias vertically connecting the re-distribution lines.

### Claim 12 (depends on 11)

The image sensor package of claim 11, further comprising:
a plurality of bumps disposed under the re-distribution layer.

### Claim 13 (depends on 1)

The image sensor package of claim 1, wherein the package substrate and the image sensor chip are arranged in a vertical direction.

### Claim 14 (depends on 1)

The image sensor package of claim 1, wherein the image sensor chip comprises:
a lower wiring layer comprising a wiring structure;
a photoelectric transformation element layer disposed on the lower wiring layer, the photoelectric transformation element layer comprising a photoelectric transformation element;
a plurality of color filters disposed on the photoelectric transformation element layer; and
a plurality of microlenses disposed on the color filters, respectively.

### Claim 15 (depends on 14)

The image sensor package of claim 14, wherein:
the image sensor chip further comprises
a plurality of conductive pads exposed at an upper surface of the image sensor chip, and
a plurality of through-silicon via (TSV) contacts electrically connected to the conductive pads, respectively, while extending vertically through the photoelectric transformation element layer and the lower wiring layer; and
the plurality of conductive pads and the plurality of TSV contacts are disposed outside a region where the photoelectric transformation element, the color filters and the microlenses are disposed.

### Claim 16

An image sensor package comprising:
an image sensor chip configured to convert light collected from an outside thereof into an electrical signal;
a package substrate disposed under the image sensor chip and configured to process the electrical signal converted from the image sensor chip;
a glass substrate disposed over the image sensor chip while being spaced apart from the image sensor chip;
a seal pattern disposed between the package substrate and the glass substrate while surrounding the image sensor chip; and
a protection pattern disposed on the package substrate outside the seal pattern,
wherein the seal pattern comprises
a first sub-pattern contacting the package substrate, and
a second sub-pattern comprising a material different from a material of the first sub-pattern, the second sub-pattern contacting the glass substrate, and
wherein the protection pattern has higher adhesiveness than the first sub-pattern.

### Claim 17 (depends on 16)

The image sensor package of claim 16, wherein:
the first sub-pattern comprises a curable polymer having adhesiveness or an epoxy-based polymer;
the second sub-pattern comprises a metal; and
the protection pattern comprises a thermosetting resin.

### Claim 18 (depends on 16)

The image sensor package of claim 16, wherein the second sub-pattern has a greater thickness than the first sub-pattern in a vertical direction.

### Claim 19 (depends on 16)

The image sensor package of claim 16, wherein an outer edge of the protection pattern is vertically aligned with an outer edge of the package substrate.

### Claim 20

An image sensor module comprising:
a base substrate;
an image sensor package disposed on the base substrate;
an optical filter disposed on the image sensor package, the optical filter comprising an infrared (IR) filter;
an optical system disposed on the optical filter, the optical system comprising a plurality of lenses;
a bracket fixing and supporting the optical filter; and
a housing fixing and supporting the optical system,
wherein the image sensor package comprises
an image sensor chip configured to convert light collected from an outside thereof into an electrical signal,
a package substrate disposed on the base substrate and under the image sensor chip, the package substrate configured to process the electrical signal converted from the image sensor chip,
a glass substrate disposed on the image sensor chip and the package substrate while having a light receiving space,
a seal pattern disposed between the package substrate and the glass substrate and surrounding the image sensor chip, and
a protection pattern disposed on the package substrate outside the seal pattern, the protection pattern comprising a single-component material,
wherein the seal pattern comprises
a first sub-pattern contacting the package substrate, and
a second sub-pattern comprising a material different from a material of the first sub-pattern, the second sub-pattern contacting the glass substrate, and
wherein the seal pattern comprises a material different from the material of the protection pattern.