# US 2022/0045043 A1 · Embedded packaging structure and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2022/0045043 A1 - Document ID: US20220045043A1 - Status: Published application - Kind: A1 - Application number: 17/393,486 - Filed: 2021-08-04 - Published: 2022-02-10 - Earliest claimed: 2020-08-05 - Assignees: Zhuhai ACCESS Semiconductor Co., Ltd. - Applicants: Zhuhai ACCESS Semiconductor Co., Ltd. - Inventors: Xianming CHEN; Benxia HUANG; Lei FENG; Lina JIANG; Bingsen XIE; Jindong FENG - Web page: https://patentgrep.com/patent/US20220045043A1 ## CPC - H10W 90/00: Package configurations - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/685: comprising multiple insulating layers - H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - G02B 6/4256: {Details of housings} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract An embedded packaging structure according to an embodiment of the present disclosure includes an optical communication device embedded in a substrate, and a blocking wall surrounding the working face opening. The optical communication device may include a working face for emitting light or receiving light. The working face may be revealed by a working face opening from a first surface of the substrate. The blocking wall may extend beyond the first surface in a direction away from the first surface. ## Claims ### Claim 1 An embedded packaging structure comprising: a substrate; an optical communication device embedded in the substrate, the optical communication device comprising a working face for emitting light or receiving light, the working face is revealed by a working face opening from a first surface of the substrate; and a blocking wall surrounding the working face opening, wherein the blocking wall extends beyond the first surface in a direction away from the first surface. ### Claim 2 (depends on 1) The embedded packaging structure according to claim 1, characterized in that the substrate comprises an insulating layer formed by a dielectric material, and first and second wiring layers on the insulating layer; and the first wiring layer is placed on the first surface of the substrate and the second wiring layer is placed on a second surface of the substrate opposite to the first surface. ### Claim 3 (depends on 2) The embedded packaging structure according to claim 2, characterized in that the first and second wiring layers are electrically connected by a metal via-column passing through the insulating layer. ### Claim 4 (depends on 1) The embedded packaging structure according to claim 1, characterized in that the packaging structure is embedded with at least two of the optical communication devices. ### Claim 5 (depends on 4) The embedded packaging structure according to claim 4, characterized in that the working faces of the at least two optical communication devices are in the same direction or in the different directions. ### Claim 6 (depends on 1) The embedded packaging structure according to claim 1, characterized in that the substrate is formed therein with a device surrounding wall surrounding the optical communication device. ### Claim 7 (depends on 6) The embedded packaging structure according to claim 6, characterized in that a metal heat dissipation layer is formed on a device back face of the optical communication device opposite to the working face. ### Claim 8 (depends on 7) The embedded packaging structure according to claim 7, characterized in that the metal heat dissipation layer and the device surrounding wall are connected by the second wiring layer. ### Claim 9 (depends on 1) The embedded packaging structure according to claim 1, characterized in that the blocking wall is made by a photosensitive resin material or a metal. ### Claim 10 (depends on 2) The embedded packaging structure according to claim 2, characterized in that the substrate further comprises an additional layer building up structure formed on the first wiring layer and/or the second wiring layer. ### Claim 11 A method for manufacturing an embedded packaging structure, the method comprising: A) preparing a substrate comprising a dielectric frame, wherein the substrate comprises a through hollow cavity surrounded by the frame and a metal via-column passing through a height of the frame; B) placing a first surface of the substrate onto a bearing part; C) placing an optical communication device into the hollow cavity of the substrate, wherein the optical communication device has a working face surface-mounted onto the bearing part; D) laminating or coating a dielectric packaging material onto a second surface of the substrate opposite to the first surface to form an insulating layer such that the dielectric packaging material fully fills a space between the optical communication device and the frame; E) thinning the insulating layer to reveal an end face of the metal via-column on the second surface; F) removing the bearing part to reveal the working face of the optical communication device and the end face of the metal via-column on the first surface; G) forming first and second wiring layers on the first and second surfaces of the substrate, wherein the first wiring layer is formed thereon with a working face opening to reveal the working face of the optical communication device from the first surface; and H) forming a blocking wall, surrounding the working face of the optical communication device, on the first surface of the substrate, wherein the blocking wall extends beyond the first surface in a direction away from the first surface. ### Claim 12 (depends on 11) The method according to claim 11, characterized in that the step A further comprises: forming a device blocking wall, surrounding the hollow cavity, in the dielectric frame. ### Claim 13 (depends on 11) The method according to claim 11, characterized in that the bearing part is selected from a thermo-decomposing or photo-decomposing adhesive tape, a sacrificing Cu foil, a glass carrying plate or a single-side Cu clad laminate coated on its surface with a thermo-decomposing or photo-decomposing adhesive. ### Claim 14 (depends on 11) The method according to claim 11, characterized in that the step G further comprises: applying a first seed layer on the first surface of the substrate; depositing a metal layer on the first seed layer; applying a photoresist on the metal layer, and performing exposure and development to form an etching resisting layer; and performing etching to the metal layer and the first seed layer, removing the etching resisting layer, and forming the first wiring layer and the working face opening. ### Claim 15 (depends on 14) The method according to claim 14, characterized in that the step G further comprises: revealing a back face of the optical communication device on the second surface of the substrate; applying a second seed layer on the second surface of the substrate; applying a photoresist on the second seed layer, and performing exposure and development to form a first pattern; and plating a metal in the first pattern and forming a second wiring layer and a metal heat dissipation layer. ### Claim 16 (depends on 14) The method according to claim 14, further comprising: after forming the first and second wiring layers, forming welding resisting layers on the first and second wiring layers. ### Claim 17 (depends on 12) The method according to claim 12, characterized in that the step G further comprises: revealing a back face of the optical communication device on the second surface of the substrate; applying a second seed layer on the second surface of the substrate; applying a photoresist on the second seed layer, and performing exposure and development to form a first pattern; and plating a metal in the first pattern and forming a second wiring layer and a metal heat dissipation layer, wherein the metal heat dissipation layer is connected, by the second wiring layer, with the device blocking wall. ### Claim 18 (depends on 11) The method according to claim 11, characterized in that the step H further comprises: applying a photosensitive resin material onto the first surface of the substrate; and performing exposure and development to cure and form the blocking wall surrounding the working face opening. ### Claim 19 (depends on 11) The method according to claim 11, characterized in that the step H further comprises: obtaining a prefabricated metal block; printing a welding material in a predetermined position of the first surface of the substrate; surface-mounting the metal block onto the welding material; and forming the blocking wall by reflow welding. ### Claim 20 (depends on 11) The method according to claim 11, characterized in that the step H further comprises: depositing a third seed layer on the first surface of the substrate; applying a photoresist on the third seed layer, and performing exposure and development to form a second pattern; plating a metal in the second pattern to form the blocking wall; and removing the photoresist and performing etching to the third seed layer.