# US 2022/0045041 A1 · Package structure and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2022/0045041 A1 - Document ID: US20220045041A1 - Status: Published application - Kind: A1 - Application number: 17/384,804 - Filed: 2021-07-26 - Published: 2022-02-10 - Earliest claimed: 2020-08-06 - Assignees: Powertech Technology Inc. - Applicants: Powertech Technology Inc. - Inventors: Shang-Yu Chang Chien; Nan-Chun Lin; Hung-Hsin Hsu - Web page: https://patentgrep.com/patent/US20220045041A1 ## CPC - H10W 90/00: Package configurations - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10P 72/74: {using temporarily an auxiliary support} - H10W 70/611: {for connecting multiple chips together} - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/685: comprising multiple insulating layers - H10W 74/014: {using batch processing} - H10W 74/114: {by a substrate and the encapsulations} - H10W 74/141: {the encapsulations being on at least the sidewalls of the semiconductor body} - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10P 72/7424: {used as a support during the manufacture of self-supporting substrates} - H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers} - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/01308: {using permanent auxiliary members, e.g. using alignment marks} - H10W 72/0198: {batch processes} - H10W 72/072: {of bump connectors} - H10W 72/073: {of die-attach connectors} - H10W 72/354: {comprising polymers} - H10W 72/387: {Flow barriers} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A package structure including a first die, an encapsulant, a first circuit structure, a second circuit structure, a conductive connector, a second die, and a filler is provided. The encapsulant covers the first die and has a first surface and a second surface opposite to each other. The first circuit structure is disposed on the first surface. The second circuit structure is disposed on the second surface. The conductive connector penetrates the encapsulant. The second die is disposed on the second circuit structure. The second die has an optical signal transmission area. The filler is disposed between the second die and the second circuit structure. An upper surface of the second circuit structure has a groove. The upper surface includes a first area and a second area disposed on opposite sides of the groove. The filler directly contacts the first area. The filler is disposed away from the second area. ## Claims ### Claim 1 A package structure, comprising: a first die; an encapsulant, covering the first die, and having a first molding surface and a second molding surface opposite to the first molding surface; a first redistributed circuit structure, disposed on the first molding surface of the encapsulant; a second redistributed circuit structure, disposed on the second molding surface of the encapsulant and electrically connected to the first die; a conductive connector, penetrating through the encapsulant and electrically connected to the first redistributed circuit structure and the second redistributed circuit structure; a second die, disposed on the second redistributed circuit structure and electrically connected to the second redistributed circuit structure, wherein the second die has an optical signal transmission area; and a filler, disposed between the second die and the second redistributed circuit structure, wherein: an upper surface of the second redistributed circuit structure has a groove, and the upper surface comprises a first area and a second area disposed on two opposite sides of the groove; the filler directly contacts the first area; and the filler is disposed away from the second area. ### Claim 2 (depends on 1) The package structure as claimed in claim 1, wherein in a direction perpendicular to the first molding surface or the second molding surface, the optical signal transmission area of the second die is not overlapped with the encapsulant. ### Claim 3 (depends on 1) The package structure as claimed in claim 1, wherein the filler further covers a part of a side surface of the second die. ### Claim 4 (depends on 1) The package structure as claimed in claim 1, wherein the filler is further filled into the groove. ### Claim 5 (depends on 1) The package structure as claimed in claim 1, wherein the groove has a strip shape, and in an extending direction of the groove, a size of the groove is larger than a size of the second die, and the size of the groove is smaller than a size of the encapsulant, a size of the first redistributed circuit structure, or a size of the second redistributed circuit structure. ### Claim 6 (depends on 1) The package structure as claimed in claim 1, further comprising: a plurality of second-die connectors, located between the second die and the second redistributed circuit structure, and electrically connected to the second die and the second redistributed circuit structure, wherein the groove has a ring shape and surrounds the second-die connectors. ### Claim 7 (depends on 1) The package structure as claimed in claim 1, wherein the second redistributed circuit structure comprises: a top insulating layer, wherein the groove penetrates through the top insulating layer; and a top conductive layer, located on the top insulating layer, and a part of the top conductive layer being further embedded in the top insulating layer. ### Claim 8 (depends on 1) The package structure as claimed in claim 1, wherein a sidewall of the groove is a slope. ### Claim 9 (depends on 8) The package structure as claimed in claim 8, wherein the second redistributed circuit structure comprises a dummy pad, and the groove exposes a surface of the dummy pad. ### Claim 10 (depends on 1) The package structure as claimed in claim 1, wherein a sidewall of the groove has a stepped structure. ### Claim 11 A manufacturing method of a package structure, comprising: providing a preliminary structure, comprising: a first die; an encapsulant, covering the first die, and having a first molding surface and a second molding surface opposite to the first molding surface; a first redistributed circuit structure, disposed on the first molding surface of the encapsulant; a second redistributed circuit structure, disposed on the second molding surface of the encapsulant and electrically connected to the first die, wherein an upper surface of the second redistributed circuit structure has a groove, and the upper surface comprises a first area and a second area disposed on two opposite sides of the groove; and a conductive connector, penetrating through the encapsulant and electrically connected to the first redistributed circuit structure and the second redistributed circuit structure; disposing a second die on the preliminary structure to be electrically connected to the second redistributed circuit structure, wherein the second die has an optical signal transmission area; and forming a filler between the second die and the second redistributed circuit structure, wherein the filler directly contacts the first area, and the filler is disposed away from the second area. ### Claim 12 (depends on 11) The manufacturing method of the package structure as claimed in claim 11, wherein forming the second redistributed circuit structure of the preliminary structure comprises: forming a top insulating material layer; and removing a part of the top insulating material layer to form the groove. ### Claim 13 (depends on 12) The manufacturing method of the package structure as claimed in claim 12, wherein forming the second redistributed circuit structure of the preliminary structure further comprises: forming the top insulating material layer on a dummy pad; and removing a part of the top insulating material layer to expose the dummy pad, so as to form the groove. ### Claim 14 (depends on 12) The manufacturing method of the package structure as claimed in claim 12, wherein forming the second redistributed circuit structure of the preliminary structure further comprises: forming an insulating layer having an insulating opening; forming the top insulating material layer on the insulating layer and further filling the insulating opening; and removing a part of the top insulating material layer located in the insulating opening and corresponding to the insulating opening, so as to form the groove. ### Claim 15 (depends on 12) The manufacturing method of the package structure as claimed in claim 12, further comprising: after forming the groove, performing cutting to form a plurality of the preliminary structures.