# US 2022/0045029 A1 · Bonding apparatus and bonding method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2022/0045029 A1 - Document ID: US20220045029A1 - Status: Published application - Kind: A1 - Application number: 17/384,750 - Filed: 2021-07-24 - Published: 2022-02-10 - Earliest claimed: 2020-08-10 - Assignees: Semes Co., Ltd. - Applicants: Semes Co., Ltd. - Inventors: Gil Yong MOON - Web page: https://patentgrep.com/patent/US20220045029A1 ## CPC - H10W 72/011: {Apparatus therefor} - H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates} - H10P 72/0602: {Temperature monitoring} - H10W 72/0198: {batch processes} - H10W 72/07125: {Means for controlling the bonding environment, e.g. valves or vacuum pumps} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07183: {Means for monitoring} - H10W 80/102: {Controlling the environment during the bonding, e.g. the temperature or pressure} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A bonding apparatus includes a stage on which a substrate is seated, a gantry installed above the stage, a bonding unit for bonding a chip to the substrate while moving along the gantry, a first temperature sensor installed on the bonding unit and providing a first temperature value of the bonding unit, a second temperature sensor installed at a periphery of the bonding apparatus and providing a second temperature value of an atmospheric temperature at the periphery of the bonding apparatus, and a control part causing the bonding unit to be aligned with a bonding position on the substrate, controlling the bonding unit to allow the bonding unit to bond the chip at the bonding position, and determining a movement distance of the bonding unit based on a weighted sum of the first temperature value and the second temperature value. ## Claims ### Claim 1 A bonding apparatus comprising: a stage on which a substrate is seated; a gantry installed above the stage; a bonding unit configured to bond a chip to the substrate while moving along the gantry; a first temperature sensor installed on the bonding unit and configured to provide a first temperature value corresponding to a temperature of the bonding unit; a second temperature sensor installed at a periphery of the bonding apparatus and configured to provide a second temperature value corresponding to an atmospheric temperature at the periphery of the bonding apparatus; and a control device configured to: cause the bonding unit to be aligned with a bonding position of the substrate, control the bonding unit to allow the bonding unit to bond the chip at the bonding position of the substrate, and determine a movement distance of the bonding unit based on a weighted sum of the first temperature value and the second temperature value. ### Claim 2 (depends on 1) The bonding apparatus of claim 1, wherein the control device is configured to correct a first weight applied to the first temperature value and correct a second weight applied to the second temperature value based on a result of a bonding inspection on the chip bonded to the substrate. ### Claim 3 (depends on 2) The bonding apparatus of claim 2, wherein the gantry comprises a first movement guide and a second movement guide that define a route for a horizontal movement of the bonding unit. ### Claim 4 (depends on 3) The bonding apparatus of claim 3, further comprising: a third temperature sensor installed on the first movement guide and configured to provide a third temperature value corresponding to a temperature of the first movement guide, wherein the control device is configured to determine the movement distance of the bonding unit based on a weighted sum of the first temperature value, the second temperature value, and the third temperature value. ### Claim 5 (depends on 4) The bonding apparatus of claim 4, wherein the control device is configured to correct the first weight, the second weight, and a third weight applied to the third temperature value based on the result of the bonding inspection on the chip bonded to the substrate. ### Claim 6 (depends on 5) The bonding apparatus of claim 5, further comprising: a fourth temperature sensor installed on the second movement guide and configured to provide a fourth temperature value corresponding to a temperature of the second movement guide, wherein the control device is configured to determine the movement distance of the bonding unit based on a weighted sum of the first temperature value, the second temperature value, the third temperature value, and the fourth temperature value. ### Claim 7 (depends on 6) The bonding apparatus of claim 6, wherein the control device is configured to correct the first weight, the second weight, the third weight, and a fourth weight applied to the fourth temperature value based on the result of the bonding inspection on the chip bonded to the substrate. ### Claim 8 A bonding method comprising: positioning a substrate on a stage; checking a bonding position of the substrate; aligning a bonding unit of a bonding apparatus with the bonding position of the substrate; and bonding a chip at the bonding position of the substrate, wherein the moving of the bonding unit comprises: acquiring a first temperature value from a first temperature sensor installed on the bonding unit; acquiring a second temperature value from a second temperature sensor installed at a periphery of the bonding apparatus; and determining a movement distance of the bonding unit based on a weighted sum of the first temperature value and the second temperature value. ### Claim 9 (depends on 8) The bonding method of claim 8, further comprising: performing a bonding inspection on the chip bonded to the substrate; and correcting a first weight applied to the first temperature value and correcting a second weight applied to the second temperature value based on a result of the bonding inspection on the chip bonded to the substrate. ### Claim 10 (depends on 9) The bonding method of claim 9, wherein the moving of the bonding unit further comprises acquiring a third temperature value corresponding to a temperature of a first movement guide from the first temperature sensor installed on the first movement guide that defines a route for a horizontal movement of the bonding unit on a gantry. ### Claim 11 (depends on 10) The bonding method of claim 10, wherein the moving of the bonding unit comprises determining the movement distance of the bonding unit based on a weighted sum of the first temperature value, the second temperature value, and the third temperature value. ### Claim 12 (depends on 11) The bonding method of claim 11, wherein the moving of the bonding unit further comprises acquiring a fourth temperature value corresponding to a temperature of a second movement guide from a fourth temperature sensor installed on the second movement guide that defines the route for the horizontal movement of the bonding unit on the gantry. ### Claim 13 (depends on 12) The bonding method of claim 12, wherein the moving of the bonding unit comprises determining the movement distance of the bonding unit based on a weighted sum of the first temperature value, the second temperature value, the third temperature value, and the fourth temperature value. ### Claim 14 (depends on 13) The bonding method of claim 13, further comprising: correcting the first weight, the second weight, a third weight applied to the third temperature value, and a fourth weight applied to the fourth temperature value based on the result of the bonding inspection on the chip on the substrate. ### Claim 15 A bonding apparatus comprising: a loading part on which a container for accommodating a substrate is seated; a substrate conveying part configured to convey the substrate from the container seated on the loading part; a bonding part configured to bond a chip to the substrate provided from the substrate conveying part; and an inspection part configured to receive, from the substrate conveying part, the substrate processed by the bonding part and inspect the chip bonded to the substrate, wherein the bonding part comprises: a stage on which the substrate is seated; a gantry installed above the stage; a bonding unit configured to bond the chip to the substrate while moving along the gantry; a first temperature sensor installed on the bonding unit and configured to provide a first temperature value corresponding to a temperature of the bonding unit; a second temperature sensor installed in the vicinity of the bonding part and configured to provide a second temperature value corresponding to a temperature in the vicinity of the bonding part; and a control device configured to: cause the bonding unit to be aligned with a bonding position of the substrate, control the bonding unit to allow the bonding unit to bond the chip at the bonding position of the substrate, and determine a movement distance of the bonding unit based on a weighted sum of the first temperature value and the second temperature value. ### Claim 16 (depends on 15) The bonding apparatus of claim 15, wherein the control device is configured to correct a first weight applied to the first temperature value and corrects a second weight applied to the second temperature value based on a result of a bonding inspection, by the inspection part, on the chip bonded to the substrate. ### Claim 17 (depends on 16) The bonding apparatus of claim 16, wherein the gantry comprises a first movement guide and a second movement guide that define a route for a horizontal movement of the bonding unit. ### Claim 18 (depends on 17) The bonding apparatus of claim 17, further comprising: a third temperature sensor installed on the first movement guide and configured to provide a third temperature value corresponding to a temperature of the first movement guide, wherein the control device is configured to determine the movement distance of the bonding unit based on a weighted sum of the first temperature value, the second temperature value, and the third temperature value. ### Claim 19 (depends on 18) The bonding apparatus of claim 18, wherein the control device is configured to correct the first weight, the second weight, and a third weight applied to the third temperature value based on the result of the bonding inspection on the chip bonded to the substrate. ### Claim 20 (depends on 17) The bonding apparatus of claim 17, further comprising: a third temperature sensor installed on the first movement guide and configured to provide a third temperature value corresponding to a temperature of the first movement guide; and a fourth temperature sensor installed on the second movement guide and configured to provide a fourth temperature value corresponding to a temperature of the second movement guide, wherein the control device is configured to: determine the movement distance of the bonding unit based on a weighted sum of the first temperature value, the second temperature value, the third temperature value, and the fourth temperature value, and correct the first weight, the second weight, a third weight applied to the third temperature value, and a fourth weight applied to the fourth temperature value based on the result of the bonding inspection on the chip bonded to the substrate.