# US 2022/0044968 A1 · Mainframe-less wafer transfer platform for wafer processing modules

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- Number: US 2022/0044968 A1
- Document ID: US20220044968A1
- Status: Published application
- Kind: A1
- Application number: 16/989,746
- Filed: 2020-08-10
- Published: 2022-02-10
- Earliest claimed: 2020-08-10
- Assignees: Applied Materials, Inc.
- Applicants: Applied Materials, Inc.
- Inventors: Sriskantharajah Thirunavukarasu; Karthik Balakrishnan; Karthik Elumalai; Eng Sheng Peh
- Web page: https://patentgrep.com/patent/US20220044968A1

## CPC

- B23K 26/0838: {by using an endless conveyor belt}
- H10P 54/00: Cutting or separating of wafers, substrates or parts of devices
- B23K 26/0093: {combined with mechanical machining or metal-working covered by other subclasses than B23K}
- B23K 26/0624: {using ultrashort pulses, i.e. pulses of 1 ns or less}
- B23K 26/0661: {disposed on the workpiece}
- B23K 26/364: for making a groove or trench, e.g. for scribing a break initiation groove
- B23K 26/402: involving non-metallic material, e.g. isolators
- H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting}
- H10P 72/0466: {characterised by the construction of the load-lock chamber}
- H10P 72/10: using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P 72/33: {into and out of processing chamber}
- H10W 46/00: Marks applied to devices, e.g. for alignment or identification
- B23K 2101/40: Semiconductor devices
- B23K 2103/172: {wherein at least one of the layers is non-metallic}
- H10W 46/503: {Located in scribe lines}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

## Claims

### Claim 1

A semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate, comprising:
a transfer module, wherein the transfer module comprises a track robot for handling the substrate;
a loadlock attached to the transfer module, wherein the loadlock comprises a linear transfer system for handling the substrate; and
a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

### Claim 2 (depends on 1)

The semiconductor processing tool of claim 1, wherein the track robot is configured to remove the substrate from a cassette and transfer the substrate to the loadlock.

### Claim 3 (depends on 1)

The semiconductor processing tool claim 1, wherein the processing chamber is a plasma etching chamber.

### Claim 4 (depends on 3)

The semiconductor processing tool of claim 3, further comprising:
a laser module attached to the transfer module, wherein the track robot is configured to transfer the substrate from the laser module to the loadlock.

### Claim 5 (depends on 1)

The semiconductor processing tool of claim 1, wherein the substrate is attached to a tape frame.

### Claim 6 (depends on 1)

The semiconductor processing tool of claim 1, wherein the linear transfer system is at least partially surrounded by a cover.

### Claim 7 (depends on 1)

The semiconductor processing tool of claim 1, wherein the loadlock is capable of supporting a vacuum pressure that is approximately 50 mTorr or lower.

### Claim 8 (depends on 1)

The semiconductor processing tool of claim 1, further comprising:
a second loadlock attached to the transfer module; and
a second processing chamber attached to the second loadlock.

### Claim 9 (depends on 8)

The semiconductor processing tool of claim 8, wherein the processing chamber and the second processing chamber are attached to the same side of the transfer module.

### Claim 10 (depends on 8)

The semiconductor processing tool of claim 8, wherein the processing chamber and the second processing chamber are attached to different sides of the transfer module.

### Claim 11

A loadlock in a processing tool for implementing hybrid laser and plasma dicing of a substrate, comprising:
an enclosure, wherein a first door is on a first side of the enclosure and a second door is on a second side of the enclosure that is opposite from the first side;
a linear actuator in the enclosure, wherein the linear actuator extends out the second door when extended; and
an end effector attached to the linear actuator.

### Claim 12 (depends on 11)

The loadlock of claim 11, further comprising:
a housing around a portion of the linear actuator.

### Claim 13 (depends on 11)

The loadlock of claim 11, wherein the end effector is configured to secure a tape frame.

### Claim 14 (depends on 11)

The loadlock of claim 11, wherein the end effector is configured to secure a wafer.

### Claim 15 (depends on 11)

The loadlock of claim 11, wherein the enclosure is capable of supporting a vacuum pressure of approximately 50 mTorr or less.

### Claim 16

A plasma laser dicing tool for dicing of a substrate, comprising:
a transfer module, wherein the transfer module comprises a track robot for handling the substrate;
a laser module attached to the transfer module, wherein the track robot is configured to insert and remove the substrate from the laser module;
a first loadlock attached to the transfer module, wherein the first loadlock comprises a first linear transfer system for handling the substrate;
a first processing chamber attached to the first loadlock, wherein the first linear transfer system of the first loadlock is configured to insert and remove the substrate from the first processing chamber;
a second loadlock attached to the transfer module, wherein the second loadlock comprises a second linear transfer system for handling the substrate; and
a second processing chamber attached to the second loadlock, wherein the second linear transfer system of the second loadlock is configured to insert and remove the substrate from the second processing chamber.

### Claim 17 (depends on 16)

The plasma laser dicing tool of claim 16, wherein the first processing chamber and the second processing chamber are plasma chambers.

### Claim 18 (depends on 16)

The plasma laser dicing tool of claim 16, wherein the first processing chamber and the second processing chamber are adjacent to each other.

### Claim 19 (depends on 16)

The plasma laser dicing tool of claim 16, wherein the first loadlock and the second loadlock each comprise:
an enclosure, wherein a first door is on a first side of the enclosure and interfaces with the transfer module, and a second door is on a second side of the enclosure that is opposite from the first side and interfaces with the first processing chamber or the second processing chamber;
a linear actuator in the enclosure, wherein the linear actuator extends out the second door when extended; and
an end effector attached to the linear actuator.

### Claim 20 (depends on 16)

The plasma laser dicing tool of claim 16, wherein the track robot is configured to remove the substrate from a cassette and transfer the substrate to the loadlock.