# US 2022/0044948 A1 · Monitoring wafer and monitoring system

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- Number: US 2022/0044948 A1
- Document ID: US20220044948A1
- Status: Published application
- Kind: A1
- Application number: 17/474,331
- Filed: 2021-09-14
- Published: 2022-02-10
- Earliest claimed: 2020-08-05
- Assignees: Changxin Memory Technologies, Inc.
- Applicants: Changxin Memory Technologies, Inc.
- Inventors: Bowei ZHANG; Lei PAN; Rong FU
- Web page: https://patentgrep.com/patent/US20220044948A1

## CPC

- H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring}
- H10P 72/0608: {of substrates stored in a container, a magazine, a carrier, a boat or the like}
- H10P 72/00: Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P 72/76: using mechanical means, e.g. clamps or pinches
- H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

The present disclosure provides a monitoring wafer and a monitoring system. The monitoring wafer includes: an initial wafer, a searchlight module, a data acquisition module and a wireless transmission module, the searchlight module is configured to emit searchlight to the wafer chuck, the data acquisition module is configured to acquire searchlight information of the searchlight on the wafer chuck, and the wireless transmission module is configured to receive and transmit the searchlight information.

## Claims

### Claim 1

A monitoring wafer, comprising:
an initial wafer, the initial wafer having a front side and a back side, the back side facing a wafer chuck; and
a wireless transmission module, as well as a searchlight module and a data acquisition module that are located on the back side, the searchlight module is configured to emit searchlight to the wafer chuck, the data acquisition module is configured to acquire searchlight information of the searchlight on the wafer chuck, and the wireless transmission module is configured to receive and transmit the searchlight information.

### Claim 2 (depends on 1)

The monitoring wafer according to claim 1, wherein the searchlight information comprises surface image information on a surface of the wafer chuck; and the data acquisition module comprises a camera unit, the camera unit is configured to obtain the surface image information.

### Claim 3 (depends on 2)

The monitoring wafer according to claim 2, wherein the searchlight comprises green light.

### Claim 4 (depends on 2)

The monitoring wafer according to claim 2, wherein the searchlight comprises purple light.

### Claim 5 (depends on 4)

The monitoring wafer according to claim 4, wherein the searchlight information further comprises spatial image information between the back side and the wafer chuck; and the camera unit is further configured to obtain the spatial image information.

### Claim 6 (depends on 1)

The monitoring wafer according to claim 1, wherein the searchlight comprises laser, and the searchlight module can perform linear scanning in at least three directions; and the data acquisition module comprises a reflection receiver, the reflection receiver is configured to receive reflected light of the searchlight and obtain energy data of the reflected light.

### Claim 7 (depends on 1)

The monitoring wafer according to claim 1, wherein the searchlight module comprises a plurality of searchlight units, and the searchlight emitted by each of the searchlight units is different; and the monitoring wafer further comprises a control module, the control module is configured to switch the searchlight units so as to emit different searchlight to the wafer chuck.

### Claim 8 (depends on 7)

The monitoring wafer according to claim 7, wherein the control module is further configured to control the wireless transmission module to transmit the searchlight information of the different searchlight to different target objects.

### Claim 9 (depends on 7)

The monitoring wafer according to claim 7, wherein the wireless transmission module is further configured to receive a control command and send the control command to the control module, and the control module is further configured to execute the control command, content of the control command comprises switching to a designated searchlight unit.

### Claim 10 (depends on 7)

The monitoring wafer according to claim 7, wherein the data acquisition module further comprises a wind speed detection unit configured to detect wind speed data, and the control module is further configured to switch the searchlight unit according to the wind speed data.

### Claim 11 (depends on 1)

A monitoring system, comprising:
at least one monitoring wafer according to claim 1; and
a data analysis device, configured to receive searchlight information transmitted by the monitoring wafer.

### Claim 12 (depends on 11)

The monitoring system according to claim 11, wherein the searchlight module comprises a plurality of searchlight units, and searchlight emitted by each of the searchlight units is different; the monitoring wafer comprises a control module, the control module is configured to switch the searchlight units so as to emit different searchlight to a wafer chuck; and the data analysis device is further configured to send a control command executed by the control module to the monitoring wafer, content of the control command comprises switching to a designated searchlight unit.

### Claim 13 (depends on 12)

The monitoring system according to claim 12, wherein a data acquisition module comprises a wind speed detection unit configured to detect wind speed data, and a wireless transmission module is configured to receive the wind speed data and transmit the wind speed data to the data analysis device; and the data analysis device is further configured to send the control command based on the wind speed data.
