# US 2022/0044874 A1 · Multi-layer ceramic electronic component, multi-layer ceramic electronic component mounting substrate, multi-layer ceramic electronic component package, and method of producing a multi-layer ceramic electronic component

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- Number: US 2022/0044874 A1
- Document ID: US20220044874A1
- Status: Published application
- Kind: A1
- Application number: 17/452,046
- Filed: 2021-10-22
- Published: 2022-02-10
- Earliest claimed: 2018-08-23
- Assignees: Taiyo Yuden Co., Ltd.
- Applicants: Taiyo Yuden Co., Ltd.
- Inventors: Hiroaki SATO
- Web page: https://patentgrep.com/patent/US20220044874A1

## CPC

- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01G 2/06: specially adapted for mounting on a printed-circuit support
- H01G 4/012: Form of non-self-supporting electrodes
- H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)}
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence)
- H05K 1/181: associated with surface mounted components
- H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers}
- H05K 2201/10015: Non-printed capacitor
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in a first direction, a first main surface including a first flat region facing in the first direction, and a second main surface including a second flat region facing in the first direction; and a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first and second directions, the first flat region being formed at a center portion of the first main surface in the second direction, the second flat region being formed at a center portion of the second main surface in the third direction.

## Claims

### Claim 1

A method of producing a multi-layer ceramic electronic component, comprising:
forming an internal electrode pattern having a predetermined thickness on an unsintered ceramic sheet;
forming a dielectric pattern in an electrode non-formation region around the internal electrode pattern on the ceramic sheet such that the dielectric pattern occupies 75% or more and less than 100% of a space portion facing the electrode non-formation region and having the predetermined thickness;
laminating in a first direction the ceramic sheets on each of which the internal electrode pattern and the dielectric pattern are formed, and thereby forming a ceramic body including a plurality of internal electrodes laminated in the first direction; and
forming a pair of external electrodes that are connected to the plurality of internal electrodes and face each other in a second direction orthogonal to the first direction,
a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first direction and the second direction.

### Claim 2 (depends on 1)

The method of producing a multi-layer ceramic electronic component according to claim 1, wherein
the ceramic body further includes a first main surface including a first flat region facing in the first direction, and a second main surface including a second flat region, the second flat region being on a side opposite to the first flat region and facing in the first direction,
wherein the first flat region being formed at a center portion of the first main surface in the second direction, and
wherein the second flat region being formed at a center portion of the second main surface in the third direction.

### Claim 3 (depends on 2)

The method of producing a multi-layer ceramic electronic component according to claim 2, wherein
a dimension of the first flat region in the third direction is 80% or more and less than 100% of the dimension of the ceramic body in the third direction.

### Claim 4 (depends on 2)

The method of producing a multi-layer ceramic electronic component according to claim 2, wherein
a dimension of the second flat region in the second direction is 80% or more and less than 100% of a dimension of the ceramic body in the second direction.

### Claim 5 (depends on 2)

The method of producing a multi-layer ceramic electronic component according to claim 2, wherein
when a first imaginary line and a second imaginary line are defined on a cross section of the ceramic body in the first direction and the third direction, the first imaginary line passing through a center point of the first main surface in the third direction and orthogonally intersecting with the first direction, the second imaginary line being parallel to the first imaginary line and having an interval from the first imaginary line, the interval being 1% of the dimension of the ceramic body in the first direction, the first flat region includes a region between two points at which the second imaginary line and the first main surface intersect with each other, and
when a third imaginary line and a fourth imaginary line are defined on a cross section of the ceramic body in the first direction and the second direction, the third imaginary line passing through a center point of the second main surface in the second direction and orthogonally intersecting with the first direction, the fourth imaginary line being parallel to the third imaginary line and having an interval from the third imaginary line, the interval being 1% of the dimension of the ceramic body in the first direction, the second flat region includes a region between two points at which the fourth imaginary line and the second main surface intersect with each other.

### Claim 6 (depends on 1)

The method of producing a multi-layer ceramic electronic component according to claim 1, wherein
the dimension of the ceramic body in the second direction is larger than 1.0 times and equal to or smaller than 1.5 times the dimension of the ceramic body in the first direction