# US 2022/0044849 A1 · Circuit substrate

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- Number: US 2022/0044849 A1
- Document ID: US20220044849A1
- Status: Published application
- Kind: A1
- Application number: 17/387,349
- Filed: 2021-07-28
- Published: 2022-02-10
- Earliest claimed: 2020-08-05
- Assignees: Koa Corporation
- Applicants: Koa Corporation
- Inventors: Satoshi KANEGAE
- Web page: https://patentgrep.com/patent/US20220044849A1

## CPC

- H01C 7/006: {Thin film resistors}
- H01C 1/01: Mounting; Supporting
- H01C 1/012: the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00)
- H01C 1/14: Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
- H01C 3/12: lying in one plane
- H01C: RESISTORS

## Abstract

Particularly, it is an object to provide a circuit substrate that can reduce a field intensity near an electrode having a high potential. A circuit substrate of the present invention includes an insulated substrate, a thin-film resistive element, and electrodes electrically connected to both sides of the thin-film resistive element, the thin-film resistive element and the electrodes being disposed on a surface of the insulated substrate. The circuit substrate is characterized in that the thin-film resistive element has a pattern in which a resistance wire is repeatedly folded back, and a dummy wire for reducing a field intensity is provided on a high-potential electrode side.

## Claims

### Claim 1

A circuit substrate comprising an insulated substrate, a thin-film resistive element, and electrodes electrically connected to both sides of the thin-film resistive element, the thin-film resistive element and the electrodes being disposed on a surface of the insulated substrate, characterized in that
the thin-film resistive element has a pattern in which a resistance wire is repeatedly folded back, and
a dummy wire for reducing a field intensity is provided on a high-potential electrode side.

### Claim 2 (depends on 1)

The circuit substrate according to claim 1, characterized in that the dummy wire is provided continuously to the fold-back pattern of the resistance wire.

### Claim 3 (depends on 2)

The circuit substrate according to claim 2, characterized in that the dummy wire is folded back to outside from the resistance wire positioned outermost of the fold-back pattern.

### Claim 4 (depends on 1)

The circuit substrate according to claim 1, characterized in that the dummy wire branches off from the resistance wire.

### Claim 5 (depends on 4)

The circuit substrate according to claim 4, characterized in that the dummy wire branches off from a fold vertex of the resistance wire.

### Claim 6 (depends on 1)

The circuit substrate according to claim 1, characterized in that a plurality of the dummy wires are provided.