Circuit board with an embedded an electronic component and method for manufacturing the same

A method for manufacturing a circuit board comprising:

• providing a multilayer wiring board comprising a first wiring board and a second wiring board stacked on the first wiring board along a first direction, wherein the first wiring board comprises at least one connecting pad, the multilayer wiring board comprises a plurality of openings surrounding the at least one connecting pad, each of the plurality of openings penetrates the second wiring board along the first direction, and a width of each of the plurality of openings gradually increases from a surface of the second wiring board facing the first wiring board toward a surface of the second wiring board facing away from the first wiring board;
• forming a receiving cavity corresponding to the at least one connecting pad by removing a region surrounded by the plurality of openings, wherein the receiving cavity comprise a receiving portion and a plurality of recessed portions, an inner wall surrounds to define the receiving portion, each of the plurality of recessed portions is recessed from the inner wall, and is a remaining part of one of the plurality of openings;
• mounting an electronic component in the receiving cavity, wherein the electronic component is electrically connected to the at least one connecting pad and spaced from the second wiring board;
• and
• filling an adhesive in a gap between the electronic component and the second wiring board, thereby obtaining the circuit board.