Printed circuit board, electronic component-embedded substrate, and manufacturing method thereof

An electronic component-embedded substrate comprising:

• a core structure including a first insulating body, a plurality of first wiring layers respectively disposed on or in the first insulating body, and a barrier layer disposed within the first insulating body and at least partially in contact with one of the plurality of first wiring layers, the core structure having a cavity penetrating through one side of the first insulating body with respect to the barrier layer;
• an electronic component disposed in the cavity;
• and
• a build-up structure including a second insulating body covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, and a second wiring layer comprised of one or more layers respectively disposed on or within the second insulating body,
• wherein a material of the barrier layer has a modulus lower than a modulus of a material of the first insulating body.

A printed circuit board comprising:

• a first insulating layer;
• a second insulating layer disposed on the first insulating layer;
• an insulating barrier layer disposed between the first and second insulating layers and separating the first insulating layer and the second insulating layer from each other;
• a wiring layer at least partially in contact with the insulating barrier layer;
• and
• a cavity penetrating through one of the first and second insulating layers and penetrating in at least a portion of the insulating barrier layer,
• wherein the insulating barrier layer provides a lowest portion of a side wall of the cavity, the lowest portion of the side wall of the cavity being in contact with a bottom surface of the cavity.

An electronic component-embedded substrate comprising:

• a core structure including a first insulating body, a plurality of first wiring layers respectively disposed on or in the first insulating body, and an insulating barrier layer disposed within the first insulating body and at least partially in contact with one of the plurality of first wiring layers, the core structure having a cavity penetrating through one side of the first insulating body and penetrating in at least a portion of the insulating barrier layer;
• an electronic component disposed in the cavity;
• and
• a build-up structure including a second insulating body covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, and a second wiring layer comprised of one or more layers respectively disposed on or within the second insulating body,
• wherein the insulating barrier layer is in contact with two insulating layers in the first insulating body and separates the two insulating layers from each other, and
• the insulating barrier layer provides a lowest portion of a side wall of the cavity, the lowest portion of the side wall of the cavity being in contact with a bottom surface of the cavity.

A method for manufacturing an electronic component-embedded substrate comprising:

• forming a core structure including a first insulating body, a plurality of first wiring layers respectively disposed on or in the first insulating body, and an insulating barrier layer disposed between first and second insulating layers among a plurality of insulating layers in the first insulating body;
• forming a cavity to penetrate through at least the first insulating layer and to partially penetrate in the insulating barrier layer;
• disposing an electronic component in the cavity;
• and
• forming a build-up structure including a second insulating body covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, and a second wiring layer comprised of one or more layers respectively disposed on or within the second insulating body.