Wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorShuhei MOMOSE
Life of this patent
Estimating the term…
Abstract
A wiring board includes an insulating base including a first principal surface, a second principal surface opposite to the first principal surface, and a first through hole penetrating the insulating base from the first principal surface to the second principal surface, a functional material provided inside the first through hole, a first insulating layer covering the first principal surface, and a first surface of the functional material, and a second insulating layer covering the second principal surface, and a second surface of functional material. A second through hole is formed in the first insulating layer, the functional material, and the second insulating layer, and a conductive layer is formed on a wall surface of the second through hole.
Claims11
A wiring board comprising:
- an insulating base including a first principal surface, a second principal surface opposite to the first principal surface, and a first through hole penetrating the insulating base from the first principal surface to the second principal surface;
- a functional material provided inside the first through hole;
- a first insulating layer covering the first principal surface, and a first surface of the functional material on the side closer to the first principal surface;
- a second insulating layer covering the second principal surface, and a second surface of functional material on the side closer to the second principal surface;
- a second through hole formed in the first insulating layer, the functional material, and the second insulating layer;
- a conductive layer formed on a wall surface of the second through hole.
Dependencies are inferred from the claim text.