Flexible metal laminate and printed circuit board using the same

Abstract

A flexible metal laminate contains an insulation layer including a polyimide film, a first liquid crystal polymer coating layer formed on one surface of the polyimide film, and a second liquid crystal polymer coating layer formed on the other surface of the polyimide film, and a metal layer formed on at least one surface of the insulation layer. A printed circuit board containing the flexible metal laminate is also disclosed. The flexible metal laminate has an excellent dielectric property of the insulation layer, and the dielectric property of the insulation layer can be maintained excellently in a high temperature and high humidity environment to preserve high-speed, low-loss signal performance. Therefore, it can be advantageously applied to 5G communication products.

Dependencies are inferred from the claim text.