Driver board assemblies and methods of forming the same
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorFeng Zhou
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a driver board assembly includes embedding one or more power device assemblies within a first PCB material layer, forming one or more cooling channels within a surface of the first PCB material layer such that the one more cooling channels extend proximate to the one or more power device assemblies, forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels, and bonding a second PCB material layer to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer.
Claims20
A method of manufacturing a driver board assembly, the method comprising:
- embedding one or more power device assemblies within a first printed circuit board (PCB) material layer;
- forming one or more cooling channels within a surface of the first PCB material layer such that the one or more cooling channels extend proximate to the one or more power device assemblies;
- forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels;
- and
- bonding a second PCB material layer to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer.
A driver board assembly, comprising:
- a first PCB material layer;
- one or more power device assemblies embedded within the first PCB material layer;
- one or more cooling channels formed within a surface of the first PCB material layer such that the one or more cooling channels extend proximate to the one or more power device assemblies;
- a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels;
- and
- a second PCB material layer bonded to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer.
A driver board assembly, comprising:
- a first PCB material layer;
- one or more power device assemblies embedded within the first PCB material layer;
- one or more cooling channels formed within a surface of the first PCB material layer such that the one or more cooling channels extend proximate to the one or more power device assemblies;
- and
- a second PCB material layer bonded to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer.
Dependencies are inferred from the claim text.