# US 2022/0037579 A1 · Oscillator

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- Number: US 2022/0037579 A1
- Document ID: US20220037579A1
- Status: Published application
- Kind: A1
- Application number: 17/387,163
- Filed: 2021-07-28
- Published: 2022-02-03
- Earliest claimed: 2020-07-30
- Assignees: Seiko Epson Corporation
- Applicants: Seiko Epson Corporation
- Inventors: Norihito Matsukawa; Manabu Kondo
- Web page: https://patentgrep.com/patent/US20220037579A1

## CPC

- H03H 9/0547: {consisting of a vertical arrangement (H03H9/0566 takes precedence)}
- H10N 30/88: Mounts; Supports; Enclosures; Casings
- H03B 5/32: being a piezoelectric resonator (selection of piezoelectric material H10N30/00)
- H03H 9/08: Holders with means for regulating temperature
- H03H 9/1021: {the BAW device being of the cantilever type}
- H10N 30/802: {Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits}
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H03B: GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS (generators adapted for electrophonic musical instruments G10H; masers or lasers H01S; generation of oscillations in plasma H05H)

## Abstract

An oscillator includes: an outer package having an accommodation space; an inner package accommodated in the accommodation space and fixed to the outer package via a heat insulating member; a vibration element accommodated in the inner package; a heat generation element accommodated in the accommodation space and fixed to the inner package; an oscillation circuit configured to oscillate the vibration element; a control circuit disposed outside the accommodation space and configured to control the heat generation element; and a conductive wire electrically coupling the outer package and the inner package.

## Claims

### Claim 1

An oscillator comprising:
an outer package having an accommodation space;
an inner package accommodated in the accommodation space and fixed to the outer package via a heat insulating member;
a vibration element accommodated in the inner package;
a heat generation element accommodated in the accommodation space and fixed to the inner package;
an oscillation circuit configured to oscillate the vibration element;
a control circuit disposed outside the accommodation space and configured to control the heat generation element; and
a conductive wire electrically coupling the outer package and the inner package.

### Claim 2 (depends on 1)

The oscillator according to claim 1, wherein
the outer package includes a first base substrate that has a first recess that accommodates the inner package, and a first lid bonded to the first base substrate so as to close an opening of the first recess,
the accommodation space is formed by the first recess and the first lid, and
the inner package is fixed to the first base substrate via the heat insulating member.

### Claim 3 (depends on 1)

The oscillator according to claim 1, wherein
the inner package includes a second base substrate that has a second recess that accommodates the vibration element, and a second lid bonded to the second base substrate so as to close an opening of the second recess,
the vibration element is fixed to the second base substrate, and
the second lid is fixed to the outer package via the heat insulating member.

### Claim 4 (depends on 3)

The oscillator according to claim 3, wherein
the inner package includes an external terminal that is disposed on a surface of the second base substrate opposite to a surface to which the second lid is bonded, and
the external terminal and the outer package are electrically coupled to each other via the conductive wire.

### Claim 5 (depends on 1)

The oscillator according to claim 1, wherein
the oscillation circuit is accommodated in the inner package.

### Claim 6 (depends on 1)

The oscillator according to claim 1, further comprising:
a temperature sensor.

### Claim 7 (depends on 1)

The oscillator according to claim 1, wherein
the accommodation space is in a depressurized state.

### Claim 8 (depends on 1)

The oscillator according to claim 1, wherein
the heat insulating member is filled in the accommodation space.

### Claim 9 (depends on 1)

The oscillator according to claim 1, wherein
the heat generation element is accommodated in the inner package.

### Claim 10 (depends on 3)

The oscillator according to claim 3, wherein
the heat generation element is disposed on a surface of the second base substrate opposite to a surface to which the second lid is bonded.